Novel semiconductor silicon wafer circle-cutting equipment

Abstract

The invention discloses novel semiconductor silicon wafer circle-cutting equipment. The novel semiconductor silicon wafer circle-cutting equipment structurally comprises a machine base, a control console, a working table top, a control panel, a system display screen, a rotating head and a cutting head. A flattening block is subjected to arc bending due to obstruction of friction force, a slow pressing wheel makes contact with a silicon wafer to flatten burrs, when a soft pressing ring is stressed, the position of gas in an expansion block is changed, a sliding block pulls supporting steel to be diverged, the section, in contact with the silicon wafer, of the soft pressing ring is sunken and then rapidly recovers under the action of an elastic piece, it is guaranteed that when the soft pressing ring slides on the surface of the silicon wafer, no large hardness collision pressure is caused between the soft pressing ring and the silicon wafer, the slow pressing wheel sinks inwards under the counter-acting force to extrude gas at the lower ends of first and second airbags upwards, the gas enters a gas inlet drum ball so that the upper end of an arc cavity can be bulged to extrude a concave cavity, the concave cavity is bent in the arc direction to eject a movable ejector rod to pry a roller to slide upwards, a rear pulling end pulls the lower middle section of a pulling cavity, thepulling cavity is lifted to increase the distance from the surface of the silicon wafer, and therefore friction force is reduced.

Description

technical field [0001] The invention belongs to the field of semiconductors, and more specifically relates to a novel semiconductor silicon wafer cutting device. Background technique [0002] Silicon wafers are common and important semiconductor materials. Semiconductor silicon wafers with conductivity between conductors and insulators are sheet-shaped silicon wafers cut from silicon blocks. The circular cutting machine can pass high-energy laser beams on the surface of silicon wafers. Irradiated for further processing, cutting out circular silicon wafers. [0003] Based on the inventor's discovery above, there are following deficiencies in the existing novel semiconductor silicon wafer cutting equipment: [0004] In order to prevent too many scratches on the silicon wafer, a thin film is usually attached to the outer side of the silicon wafer. During the circle cutting work of the silicon wafer, the cutting is carried out together with the thin film. The edges will cause ...

AI Technical Summary

Problems solved by technology

[0004] In order to prevent too many scratches on the silicon wafer, a thin film is usually attached to the outer side of the silicon wafer. During the circle cutting work of the silicon wafer, the cutting is carried out together with the thin film. The edges are raised, resulting in film burrs on the edge of the silicon wafer after rounding, causing the film to be easily detached from the silicon wafer and causing scratches on the round silicon wafer

Images