Electrolysis recovery device for copper-containing waste liquid of printed circuit board
A printed circuit board, electrolytic recovery technology, applied in the direction of electrolytic process, electrolytic components, process efficiency improvement, etc., can solve the problems of low replacement efficiency, short contact time, low recovery rate of copper-containing waste liquid, etc., and achieve replacement efficiency High, long electrolysis time, the effect of improving the utilization rate
Pending Publication Date: 2020-12-15
昆山卫司特环保设备有限公司
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Problems solved by technology
[0006] In view of the shortcomings of the prior art described above, the object of the present invention is to provide an electrolytic recovery device for printed circuit board copper-containing waste liquid, which is used to solve the recovery of printed circuit board copper-containing waste liquid in the prior art. In order to solve the problems of low efficiency, short contact time and low replacement efficiency, the provided electrolysis recovery device has the advantages of high electrolysis efficiency, high utilization rate of recycled materials and high replacement efficiency
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[0029] The implementation of the present invention will be illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.
[0030] see Figure 1 to Figure 5 . It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not used to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the sa...
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Abstract
The invention relates to the technical field of copper waste liquid electrolysis recovery devices, in particular to an electrolysis recovery device for copper-containing waste liquid of a printed circuit board. The electrolysis recovery device comprises a pretreatment unit and an electrolysis unit, wherein the pretreatment unit comprise a header tank, a blow-off pipe and a chemical adding pipe, aheating plate and stirring blades are installed at the bottom of the header tank, the blow-off pipe is connected with the header tank in a penetrating manner, the chemical adding pipe is installed atthe top of the header tank, a nanofiltration membrane is arranged between a concentration cavity and a circulating cavity, the electrolysis unit comprises a tubular electrolytic cell and a power supply, a base is arranged in the tubular electrolytic cell and used for placing an anode metal bar and a cathode metal bar, and the anode metal bar and the cathode metal bar are electrically connected with the power supply to form a closed loop. According to the electrolysis recovery device for the copper-containing waste liquid of the printed circuit board, the problems of lower recovery rate, shortcontact time and low replacement efficiency of the copper-containing waste liquid of the printed circuit board in the prior art are solved, and an electrolysis recovery device has the advantages of high electrolysis efficiency, high recycling material utilization rate and high replacement efficiency.
Description
technical field [0001] The invention relates to the technical field of electrolytic recovery devices for copper waste liquid, in particular to an electrolytic recovery device for printed circuit board copper-containing waste liquid. Background technique [0002] Chemistry is widely used in the production and processing of printed circuit boards with through holes. Its main purpose is to deposit a layer on the non-conductive tomb village through a series of chemical treatment methods, and then thicken it by electroplating to achieve a specific design thickness. , and sometimes even deposited directly to the required thickness by chemical methods. The chemical copper process is through a series of necessary steps to finally complete the deposition of chemical copper. [0003] With the rapid development of the information industry and the popularization of household appliances, the production of printed circuit boards (pcb) in our country shows a trend of rapid growth. At pre...
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IPC IPC(8): C25C1/12C25C7/06C23F1/46C23F1/18
CPCC25C1/12C25C7/06C23F1/46C23F1/18Y02P10/20
Inventor 林世民
Owner 昆山卫司特环保设备有限公司
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