Workpiece conveying system, workpiece conveying method and laser annealing equipment

Abstract

The invention discloses a workpiece conveying system, a workpiece conveying method and laser annealing equipment. The workpiece conveying system is used for conveying workpieces among a workpiece storage device, a pretreatment mechanism and a workpiece table, and the workpiece conveying system comprises a conveying manipulator, a factory gas source, a standby gas source and a pipeline. The conveying manipulator conveys the workpieces among the workpiece storage device, the pretreatment mechanism and the workpiece table, is connected with the factory gas source through a pipeline, and is configured to enable the workpieces to be located at a safety station after the factory gas source is abnormal; and the standby gas source and the factory gas source are arranged in parallel, and the standby gas source is configured to supply a gas to the conveying manipulator when the factory gas source is abnormal. According to the workpiece conveying system, the workpiece cannot fall off or be damaged due to abnormity of the factory gas source in the workpiece conveying process, laser annealing process efficiency can be improved, and laser annealing process cost is saved. Correspondingly, the invention further provides the workpiece conveying method and the laser annealing equipment.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a workpiece transmission system, a workpiece transmission method and laser annealing equipment. Background technique [0002] Compared with the traditional annealing process, the laser annealing process has the advantages of high activation rate and less damage to the device. It gradually replaces the traditional annealing process in the manufacturing fields of insulated gate bipolar transistors, thin film transistors and image sensors. The workpiece table of the laser annealing equipment adopts a pinless method to absorb silicon wafers. Therefore, Bernoulli manipulators are generally used to absorb silicon wafers from the upper surface of the silicon wafers for silicon wafer transportation. The manipulator is provided with positive pressure by the factory air circuit. However, this adsorption method is easily affected by the abnormal gas failure of the factory ser...

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Problems solved by technology

However, this adsorption method is easily affected by the abnormal gas failure of the factory service air circuit, which makes the silicon wafer transmission a safety hazard. Once the factory service gas circuit is abnormally disconnected, the manipulator can no longer absorb the silicon wafer, and the silicon wafer will fall or even be damaged due to the drop. Fragmentation occurs, which affects the process cost and efficiency of laser annealing

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