A micro-device transfer device and transfer method

Abstract

The invention discloses a micro-device transfer device and a transfer method. The micro-device transfer device includes a temperature control substrate, a shape adaptation layer, and an adhesive unit arranged in an array. The adhesive unit includes an elastic body and is arranged in the elastic body for controlling For the temperature control element group, the elastic body of the adhesion unit is a micron-scale columnar structure, the elastic body is made of entropy elastic material, and the temperature control element group is electrically connected to the temperature control substrate. During the transfer process, according to the weight and shape of the target transfer device, the target temperature of the corresponding adhesion unit is set through the temperature control substrate, and the device is picked up and transferred to the target position after forming a good contact with the target device; The cell is separated from the target device, completing the device transfer. The invention can adjust the size of the adhesive force according to the needs, can basically prevent stress on the device during the transfer process, and is especially suitable for the transfer of high-precision devices and ultra-thin devices.

Description

technical field [0001] The invention belongs to the field of photoelectric technology and relates to a chip transfer technology, in particular to a micro device transfer device and a transfer method. Background technique [0002] With the development of electronic manufacturing technology, the miniaturization and cost reduction of electronic equipment also make the electronic devices in them develop in the direction of lighter, thinner and more efficient. Taking electronic chips as an example, since the first generation of chips in the 1950s, chip manufacturing technology has developed rapidly. For example, microchips with a size on the order of microns have great application prospects in display devices, mobile phones, and even living organisms. However, after the preparation is completed, how to quickly and stably transfer a large number of chips from the donor substrate to the receiving substrate for further operations without causing damage to the chip has become a probl...

AI Technical Summary

Problems solved by technology

However, the electric field and electrostatic interaction may affect the internal structure of the chip, thus limiting the practicality of the transfer device

Similarly, the patent with the publication number CN110753487A provides a device that utilizes the capillary action of the liquid water film to absorb the chip. Although this force is soft and not easy to damage the chip, water vapor is also likely to affect the internal structure of the chip.

The patents with publication numbers CN 110752167A and CN110797295A use the phase change or volume shrinkage and expansion of the photosensitive adhesive layer to control the adhesion and detachment of the chip respectively. However, in the process, the photosensitive adhesive layer will be greatly deformed under pressure. Improper operation of the pressure application process can easily damage the chip. In addition, the photosensitive adhesive is also likely to remain on the surface of the target chip, causing pollution

[0004] In addition, for some electronic devices such as chips with curvature on the surface, it is often difficult for existing chip transfer devices to form a good contact with the surface, which leads to instability or even failure in the process of adhesion and transfer.

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