Polycrystalline silicon wafer cutting device for producing solar cell panel

Abstract

The invention relates to the technical field of cutting devices, in particular to a polycrystalline silicon wafer cutting device for producing a solar cell panel. The polycrystalline silicon wafer cutting device comprises a cutting box, a first conveyor, a second conveyor, a corner clamping device, a translation duplex synchronous lifting mechanism, a diamond wire cutter, a water cooling mechanismand a pick-and-place adsorption work frame, wherein a feed port and a discharge port are respectively arranged in the opposite sides of the cutting box, and a dust suction port communicated with theinput end of an air pump is also arranged in the top end of the cutting box; the first conveyor and the second conveyor are respectively arranged in the discharge port and the dust suction port in parallel; the corner clamping device is arranged on a conveyor belt of the first conveyor and used for fixing the four corners of the bottom end of a silicon ingot; the translation duplex synchronous lifting mechanism is arranged at the bottom end of the first conveyor; the diamond wire cutter is arranged at the duplex working end of the translation duplex synchronous lifting mechanism; the working end of the water cooling mechanism horizontally faces a cutting part of the diamond wire cutter and is arranged at the duplex working end of the translation duplex synchronous lifting mechanism; and the pick-and-place adsorption work frame is arranged in the cutting box. According to the polycrystalline silicon wafer cutting device, cutting dust can be effectively prevented from polluting the working environment, and the silicon ingot can be automatically cut.

Description

technical field [0001] The invention relates to the technical field of cutting devices, in particular to a polycrystalline silicon wafer cutting device for producing solar panels. Background technique [0002] With the continuous development of the photovoltaic industry, the demand for solar-grade silicon wafers is increasing. Solar grade silicon wafers are divided into two types: monocrystalline and polycrystalline silicon wafers. Compared with monocrystalline silicon wafers, polycrystalline silicon wafers have lower cost and faster growth rate outside the electroplating layer. Polycrystalline silicon cells have always occupied the main market in solar cells. Due to the high hardness of polysilicon, diamond sand wire is used for cutting large-sized polysilicon at present. [0003] The cutting devices on the market will produce some particles and impurities during the cutting process of polycrystalline silicon wafers. Long-term use will affect human health and cause damage...

AI Technical Summary

Problems solved by technology

[0005]The cutting device controls the lifting and lowering of the threaded sliding sleeve through two driving motors, and then controls the lifting of the sliding sleeve, which can easily cause the motors on both sides to drive out of sync and cause the diamond wire to fail to cut normally , when cutting, the dust suction port only sucks dust on one side, which cannot effectively remove dust

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