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Automatic silicon wafer packaging method and system

A technology of silicon wafers and packaging boxes, which is applied in the field of solar silicon wafers, can solve the problems of high labor intensity and low production efficiency of silicon wafer packaging, and achieve the effect of reducing labor intensity and improving production efficiency

Active Publication Date: 2020-12-29
YINCHUAN LONGI SILICON MATERIALS
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Problems solved by technology

[0003] The embodiments of the present disclosure provide a method and system for automatic packaging of silicon wafers, which can solve the problems of high labor intensity and low production efficiency of existing silicon wafer packaging

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  • Automatic silicon wafer packaging method and system
  • Automatic silicon wafer packaging method and system
  • Automatic silicon wafer packaging method and system

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Embodiment Construction

[0051] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present disclosure as recited in the appended claims.

[0052] An embodiment of the present disclosure provides an automatic packaging method for silicon wafers, such as figure 1 Shown, this silicon chip automatic packing method comprises the following steps:

[0053] 101. The main control system acquires an empty container demand instruction sent by a target machine of a target production line.

[0054] The empty box demand instruction i...

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Abstract

The invention provides an automatic silicon wafer packaging method and system, and relates to the technical field of solar silicon wafers. The problems of high labor intensity and low production efficiency of existing silicon wafer packaging can be solved. According to the specific technical scheme, unified control over box opening, boxing, stacking and packaging is achieved through a main controlsystem, the automatic process of the silicon wafer packaging procedure is achieved, the labor intensity of personnel is greatly reduced, and the production efficiency is improved.

Description

technical field [0001] The present disclosure relates to the technical field of solar silicon wafers, in particular to an automatic packaging method and system for silicon wafers. Background technique [0002] At present, in the packaging process of solar silicon wafers, the packing, palletizing, palletizing, and wrapping of finished silicon wafers often require manual operations. The development requirements of the automation of the whole industry chain of wafer processing, and with the characteristic development of silicon wafers, the classification packaging of different sizes and models also puts forward new requirements for the automatic packaging system. Therefore, how to improve the production efficiency of the silicon wafer packaging system and reduce the The labor intensity of personnel to meet the automation development direction of the silicon wafer processing industry is an urgent problem to be solved. Contents of the invention [0003] Embodiments of the pres...

Claims

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Application Information

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IPC IPC(8): B65B57/00B65B43/26B65B5/10B65B51/00B65B17/00B65B57/04B65B61/26
CPCB65B57/00B65B43/26B65B5/10B65B51/00B65B17/00B65B57/04B65B61/26
Inventor 张赵鸣杨德玉刘兴仓杨帆
Owner YINCHUAN LONGI SILICON MATERIALS
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