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Preparation method of copper-clad plate with ultralow-water-absorption

A technology of copper clad laminate and water absorption, which is applied in the field of preparation of ultra-low water absorption copper clad laminate, and can solve the problem of high water absorption of film materials

Active Publication Date: 2021-01-01
江苏中际信通讯材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The defect in the prior art is that the voids in the polytetrafluoroethylene film obtained by calendering, drying and sintering have directionality, and the lamination can only act on the longitudinal pores in the same direction as the lamination force, so as to improve the longitudinal quality of the film. The density of the film is insufficient to make up for the transverse pores, so the water absorption of the membrane is relatively high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] S1, mix the polytetrafluoroethylene resin powder of 50g and the silicon oxide filler of 50g (based on the sum of the mass of polytetrafluoroethylene resin powder and filler silicon oxide 100%, the mass percent of filler is 50%), then add The Isopar-M solvent oil of 20g is fully mixed, and extruded to obtain a rod, and the rod is fed into a calender and calendered to obtain a 100 μm calendered film;

[0036] S2, heat-treat the calendered film of S1 at 280°C for 10 minutes, and cool down;

[0037] S3, apply a polytetrafluoroethylene emulsion with a solid content of 40% on the surface of the calendered film of S2, control the coating thickness to 10 μm with a scraper, dry at 150 ° C, and sinter at 330 ° C for 10 minutes to obtain surface fluorinated polytetrafluoroethylene vinyl film;

[0038] S4, a single-layer polytetrafluoroethylene film is laminated. The temperature of the polytetrafluoroethylene film is raised from room temperature to 370 ° C, kept for 2 hours, and t...

Embodiment 2

[0040]Embodiment 2 is based on embodiment 1, and the difference is that the raw material of the calendered film is composed of: based on 100% of the mass sum of polytetrafluoroethylene resin powder and filler silicon oxide, the mass percentage of the filler is 40%; the thickness of the calendered film is 100 μm; the thickness of PFA emulsion coating is 10 μm, a single layer of polytetrafluoroethylene film is laminated in S4, and the thickness of copper clad laminate is 111 μm.

Embodiment 3

[0042] Example 3 is based on Example 1, with the difference that a lamination pressure of 8 MPa is applied to the polytetrafluoroethylene film; in S4, a double-layer polytetrafluoroethylene film is laminated, and the thickness of the copper clad laminate is 220 μm.

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Abstract

The invention discloses a preparation method of a copper-clad plate with ultralow water absorption. The method comprises the following steps: S1, uniformly mixing polytetrafluoroethylene and inorganicreinforcing filler, and calendering to obtain a calendered film; S2, carrying out heat treatment on a calendered film obtained in the step S1 at the heat treatment temperature of 100-330 DEG C; S3, applying fluororesin emulsion to the surface of the calendered film obtained in the S2, and drying and sintering to obtain a polytetrafluoroethylene film subjected to surface fluorination treatment; and S4, heating and laminating one or more than two layers of polytetrafluoroethylene films to obtain a finished product of the copper-clad plate with the ultralow water absorption rate. In S4, the heating and laminating process comprises heating the polytetrafluoroethylene film to 330-380 DEG C, keeping the temperature for 1.5-3 hours, and cooling; and the lamination pressure of 5-8 Mpa is appliedto the polytetrafluoroethylene film in the heating, heat preservation and cooling processes. According to the preparation method of the copper-clad plate with the ultra-low water absorption rate, thelamination pressure is increased, pores in all directions in the film are reduced, finally, the pore filling rate close to 100% is achieved, and the water absorption rate of the copper-clad plate is reduced.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminates, in particular to a method for preparing a copper-clad laminate with ultra-low water absorption. Background technique [0002] Copper clad laminates need to have low water absorption and high thermal conductivity. Polytetrafluoroethylene (PTFE) has extremely small water absorption and is a very good resin matrix for high-performance copper clad laminates. The main method to improve the thermal conductivity of copper clad laminates is to add fillers. The greater the amount of filler added, the more conducive to the improvement of the thermal conductivity of the plate. Simply increasing the amount of filler added will increase the probability of microscopic pores on the surface and inside of the board. After the copper clad laminate is damp, the water absorption rate is high, which affects the dielectric constant and dielectric loss of the copper clad laminate, thereby affecting the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/06B32B37/10B32B37/00B32B38/16B32B38/00B32B27/32B32B27/08B32B33/00B29D7/01
CPCB32B37/06B32B37/10B32B37/00B32B38/164B32B38/0036B32B27/322B32B27/08B32B33/00B29D7/01B32B2037/243
Inventor 陈晓燕陈怡方
Owner 江苏中际信通讯材料有限公司
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