Diamond saw wire fracture prediction method based on image processing

Abstract

The invention provides a diamond saw wire fracture prediction method based on image processing, and the method specifically comprises the steps: reading a photographing content, and reading a to-be-fractured and fractured image of a saw wire; performing gray processing on the picture; carrying out edge detection by adopting a Canny operator, processing the grayscale image, and extracting the edgeof the grayscale image; extracting local features of the image by adopting statistical probability Hough transform to obtain a straight line segment in the image; extracting polar coordinates of segment selection endpoints; establishing a vector a of a reference coordinate line segment, and performing included angle calculation on the segment selection vector b obtained in the previous step and the reference vector a; determining a limit angle record alpha before the saw wire is broken; detecting the machining states at different moments, and measuring the saw wire deflection angle cut by thesaw wire at any time and recorded as [beta]; and comparing [beta] with alpha, wherein if [beta] is infinitely close to [alpha], feeding or machining of the workpiece is stopped. The method has the beneficial effects that compared with a shot picture drawing angle measurement method, the time cost is saved, and the efficiency is higher.

Description

technical field [0001] The invention belongs to the field of precision machining and relates to a diamond saw wire fracture prediction method. Background technique [0002] At present, semiconductor materials are widely used in the field of microelectronics, and the vast majority of semiconductor materials use silicon wafers. Slicing is an important process for turning silicon rods into silicon wafers. The quality of silicon wafers directly affects the subsequent processing costs. Diamond wire saw cutting technology has the advantages of high cutting efficiency, small wire loss, high slicing accuracy and low pollution, and has broad application prospects. However, in the process of processing, there has always been a problem of wire failure, which seriously affects the quality of the processed workpiece. [0003] The problem of wire failure is also an important factor in determining the range of processing parameters, namely wire speed, tension force, and workpiece feed sp...

AI Technical Summary

Problems solved by technology

At present, most scholars have studied the reason deeply through the cutting mechanism, but have not proposed an effective method to prevent frac...

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