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Preparation method of low-alpha BGA (ball grid array) solder ball and BGA solder ball

A technology of alpha and solder balls, applied in the field of preparation of low-alpha BGA solder balls, which can solve the problems of high process energy consumption and unfeasible industrial production.

Pending Publication Date: 2021-01-08
CHONGQING QUNWIN ELECTRONICS MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This method can directly remove radioactive isotopes in the raw material, but the energy consumption of this process is very high, and it is not feasible in industrial production

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  • Preparation method of low-alpha BGA (ball grid array) solder ball and BGA solder ball

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Embodiment Construction

[0026] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] The present invention is illustrated by taking the preparation of SAC305 solder balls as an example. It should be understood that Sn42Bi57.4Ag0.6 solder balls, Sn90Sb10 solder balls and other solder balls with different solder ratios or solder balls with different solder ratios are correspondingly suitable for the present invention.

[0028] SAC305 solder balls include three kinds of single-substance solders, namely Sn, Ag, and Cu. Among them, according to the mass ratio, Sn:Ag:Cu=96.5:3.5:0.5.

[0029] The present invention prep...

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Abstract

The invention provides a preparation method of a low-alpha BGA (ball grid array) solder ball. The preparation method comprises the following steps of: providing various low-purity elementary solder required for preparing the BGA solder ball; removing impurities in each elementary solder to purify the elementary solder; and alloying the purified elementary solder to prepare the low-alpha BGA solderball. The preparation method has the advantages that the direct recovery rate of metal is high, and the alpha particle radiation quantity is lower than the level of 0.001cph / cm< 2 >.

Description

technical field [0001] The present invention relates to BGA tin ball technical field, relate in particular to a kind of preparation method of low alpha BGA tin ball and BGA tin ball. Background technique [0002] The size and operating voltage of electronic equipment are continuously decreasing, and the volume of semiconductor devices is continuously decreasing, resulting in the continuous reduction of transistor size and operating voltage, which brings new challenges to packaging technology and materials. The size ratio of semiconductor devices is reduced, which means that the circuits in the semiconductor will be denser, the silicon wafers will be thinner, and the capacitor voltage of the non-permanent memory will be lower, which will lead to soft errors of the semiconductor devices (soft errors refer to single-crystal Temporary malfunctions of devices caused by silicon radiation) are more sensitive because low-energy alpha particles can flip memory cells or change timing ...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/40B23K35/14
CPCB23K35/0244B23K35/262B23K35/40
Inventor 林文良吴华丰袁鹏
Owner CHONGQING QUNWIN ELECTRONICS MATERIAL CO LTD