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Glass round piece polishing device

A wafer and glass technology, applied in the field of glass wafer grinding devices, can solve problems such as unfavorable practical use, complicated operation, difficulty in aligning the center of the wafer, etc.

Inactive Publication Date: 2021-01-08
梁云招
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] With the existing wafer grinding device, when grinding the corners of glass wafers with different diameters, it is difficult to calibrate the center of the wafer, prone to deviation, and the operation is complicated, which is not conducive to practical use

Method used

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Embodiment Construction

[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0024] see Figure 1-4 As shown, a glass wafer grinding device includes a rotating module 100. The rotating module 100 includes a support cylinder 110. The inner wall of the support cylinder 110 is slidably fitted with a sliding sleeve 120. The inner wall of the sliding sleeve 120 is provided with a threaded groove. The sliding sleeve 120 The inner wall of the inner wall is screwed and connected with a threaded rod 130, and the bottom end of the threaded rod 130 is connected with ...

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PUM

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Abstract

The invention relates to the technical field of glass polishing, in particular to a glass round piece polishing device. The glass round piece polishing device comprises a rotating module, the rotatingmodule comprises a supporting cylinder, the inner wall of the supporting cylinder is slidably sleeved with a sliding sleeve, a threaded groove is formed in the inner wall of the sliding sleeve, a threaded rod is connected with the inner wall of the sliding sleeve in a screwed mode, and the bottom end of the threaded rod is rotationally connected with the inner bottom surface of the supporting cylinder. According to the glass round piece polishing device, through the arrangement of a positioning module, a U-shaped rod II moves, a gear drives a U-shaped rod I to move reversely for the same distance, so that two rotating sleeves I and two rotating sleeves II move close to each other to clamp and limit a glass round piece, the circle center position of the glass round piece coincides with theaxis of the output end of a motor, accurate positioning of the circle center of the glass round piece is achieved, operation is easy, two rubber suction cups clamp and fix the glass round piece through the arrangement of the rubber suction cups and the sliding sleeve, the motor can conveniently drive the glass round piece to rotate, and therefore grinding is conducted.

Description

technical field [0001] The invention relates to the technical field of glass grinding devices, in particular to a glass wafer grinding device. Background technique [0002] Glass is an amorphous inorganic non-metallic material, generally made of various inorganic minerals (such as quartz sand, borax, boric acid, barite, barium carbonate, limestone, feldspar, soda ash, etc.) of. Its main components are silicon dioxide and other oxides. The main component of ordinary glass is silicate double salt, which is an amorphous solid with irregular structure. Widely used in buildings, used for wind and light transmission, belongs to the mixture. There are also colored glass that is mixed with certain metal oxides or salts to show color, and tempered glass made by physical or chemical methods. Sometimes some transparent plastics (such as polymethyl methacrylate) are also called plexiglass. After the glass wafer blank is cut out, the edges are relatively sharp and untidy, and a grin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B9/10B24B27/00B24B41/06B24B47/00B24B47/12B24B47/22
CPCB24B9/10B24B27/0084B24B41/061B24B47/00B24B47/12B24B47/22
Inventor 梁云招
Owner 梁云招
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