Glass round piece polishing device
A wafer and glass technology, applied in the field of glass wafer grinding devices, can solve problems such as unfavorable practical use, complicated operation, difficulty in aligning the center of the wafer, etc.
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[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0024] see Figure 1-4 As shown, a glass wafer grinding device includes a rotating module 100. The rotating module 100 includes a support cylinder 110. The inner wall of the support cylinder 110 is slidably fitted with a sliding sleeve 120. The inner wall of the sliding sleeve 120 is provided with a threaded groove. The sliding sleeve 120 The inner wall of the inner wall is screwed and connected with a threaded rod 130, and the bottom end of the threaded rod 130 is connected with ...
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