A kind of dispensing and condensing device for semiconductor chip manufacturing and its use method

Abstract

The invention discloses a dispensing and condensing device for manufacturing semiconductor chips and a method for using the same. It includes a mounting pipe, a support pipe is fixedly mounted on the top of the mounting pipe, and a drive motor is fixedly mounted on the inner wall of the top of the mounting pipe. The output shaft of the driving motor extends into the support tube and is fixedly installed with a support plate, the top of the support plate is fixedly equipped with an electric push rod, and the output shaft of the electric push rod is fixedly mounted with a mounting plate, the bottom of the mounting plate, etc. There are multiple mounting brackets for pitch swivel connections. The present invention clamps multiple chips and moves multiple chips, so that the chips can be continuously in contact with the surrounding cooling gas, so the purpose of rapid cooling can be achieved, so there is no need for secondary cooling, and can Realize cooling down multiple chips at the same time, so work efficiency can be effectively improved, and production capacity can be further effectively increased.

Description

technical field [0001] The invention relates to the technical field related to semiconductors, in particular to a dispensing and condensing device for manufacturing semiconductor chips and a method for using the same. Background technique [0002] A chip refers to a silicon chip containing an integrated circuit, which is small in size and is often a part of a computer or other electronic equipment. A chip generally refers to the carrier of an integrated circuit, and is also the result of the design, manufacture, packaging, and testing of an integrated circuit. An independent whole that can be used immediately. In electronics, an integrated circuit is a way to miniaturize a circuit (mainly including semiconductor devices, but also passive components, etc.), and is often manufactured on the surface of a semiconductor wafer. The transistor was invented and After mass production, various solid-state semiconductor components such as diodes and transistors were widely used, replac...

AI Technical Summary

Problems solved by technology

[0003] The existing dispensing and condensing devices generally have a poor condensation effect, and the processed electronic chips can easily fail to achieve the desired effect, requiring secondary processing, which will not only affect the working speed, but also reduce the quality of the product, and the existing The condensing device has a small number of processed products in a single batch, which cannot meet the requirements of mass production and reduces processing efficiency. Therefore, we propose a dispensing and condensing device for semiconductor chip manufacturing and its use method to solve the above-mentioned problems.

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