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Surface-mounted hybrid coupler

A hybrid coupler, surface mount technology, applied in connecting devices, waveguide-type devices, electrical components, etc., can solve the problems of the hybrid coupler being difficult to be symmetrical, difficult to provide the characteristic impedance of the transmission line, etc., to achieve easy mass production, Effects of low dissipative losses, strong coupling and symmetry

Pending Publication Date: 2021-01-15
增强信(苏州)通信设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, hybrid couplers are difficult to be able to handle symmetry and to provide good transmission line characteristic impedance over a broadband frequency range

Method used

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Embodiment Construction

[0054] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.

[0055] It should be noted that like numerals and let...

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Abstract

The invention relates to a surface-mounted hybrid coupler. Metallized through holes I to III penetrate through dielectric layers II to V from a copper foil layer I to a copper foil layer V; metalizedthrough holes IV to VII penetrate through the dielectric layers II to VI from the copper foil layer I to a copper foil layer VI; metallized through holes VIII to IX penetrate through the dielectric layers V to VI to the copper foil layer VI from the copper foil layer IV; a microstrip transmission line I is located on the copper foil layer V, one end of the microstrip transmission line I is connected with the metallized through hole II, and the other end of the microstrip transmission line I is connected with the metallized through hole V; a microstrip transmission line II is located on the copper foil layer V, one end of the microstrip transmission line II is connected with the metallized through hole I, and the other end of the microstrip transmission line II is connected with the metallized through hole IV; a spiral microstrip line I is located on the copper foil layer II, one end of the spiral microstrip line I is connected with the metalized through hole VI, and the other end of the spiral microstrip line I is connected with the metalized through hole I; a spiral microstrip line II is located on the copper foil layer III, one end of the spiral microstrip line II is connected with the metalized through hole VII, and the other end of the spiral microstrip line II is connected with the metalized through hole II; a metallized grounding layer I is connected with a metallized grounding layer II through the metallized through hole III; one side of the metallized grounding layer II is connected with a pin port II through the metallized through hole VIII, and the other side of the second metallized grounding layer II is connected with a pin port V through the metallized through hole IX.

Description

technical field [0001] The invention relates to a microwave / RF device, in particular to a surface mount hybrid coupler, which belongs to the technical field of microwave communication equipment. Background technique [0002] Currently, couplers include Lange couplers, branch line couplers, directional couplers, tee couplers and other Wilkinson couplers. [0003] In many applications, it is desirable for the couplers to perform symmetrically balanced, so that symmetrical couplers extend compatibility among applications. [0004] As mentioned above, when the RF signal is input to the first port (input port) of the symmetrical coupler, there is a 3db signal at the fourth port (DC port), and a second 3db signal at the sixth port (coupling port), There is no apparent signal available on the third port (isolated port). In a symmetrical coupler, the input signal can be directed to the third port (isolated port) such that a 3db signal is available at the fourth (output port) port ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P5/16
CPCH01P5/16
Inventor 俞志华
Owner 增强信(苏州)通信设备有限公司
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