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Metrology apparatus and method for determining a characteristic of one or more structures on a substrate

A technology for measuring equipment and characteristics, used in scattering characteristics measurement, opto-mechanical equipment, neural learning methods, etc.

Active Publication Date: 2021-01-15
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This may result in optics that cannot be manufactured, or may result in optics that become too expensive for metrology or inspection equipment

Method used

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  • Metrology apparatus and method for determining a characteristic of one or more structures on a substrate
  • Metrology apparatus and method for determining a characteristic of one or more structures on a substrate
  • Metrology apparatus and method for determining a characteristic of one or more structures on a substrate

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Embodiment Construction

[0032] In this document, the terms "radiation" and "beam" are used to cover all types of electromagnetic radiation, including ultraviolet radiation (e.g. having a wavelength of 365, 248, 193, 157 or 126 nm) and extreme ultraviolet radiation (EUV, e.g. having wavelengths in the range of about 5 to 100 nm).

[0033] As used herein, the terms "reticle", "mask" or "patterning device" may be broadly interpreted to refer to a general patterning device that can be used to impart a patterned cross-section to an incident radiation beam, so The patterned cross-section corresponds to the pattern to be created in the target portion of the substrate. In this context, the term "light valve" may also be used. In addition to classical masks (transmissive or reflective; binary, phase-shifted, hybrid, etc.), examples of other such patterning devices include programmable mirror arrays and programmable LCD arrays.

[0034] figure 1A lithographic apparatus LA is schematically depicted. The lit...

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Abstract

Disclosed is a method of determining a characteristic of interest relating to a structure on a substrate formed by a lithographic process, the method comprising: obtaining an input image of the structure; and using a trained neural network to determine the characteristic of interest from said input image. Also disclosed is a reticle comprising a target forming feature comprising more than two sub-features each having different sensitivities to a characteristic of interest when imaged onto a substrate to form a corresponding target structure on said substrate. Related methods and apparatuses are also described.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to European application 18176718.7 filed on 08.06.2018, European application 18190559.7 filed on 23.08.2018, European application 18206279.4 filed on 14.11.2018, all of these European applications are adopted in their entirety Incorporated herein by reference. technical field [0003] The invention relates to a metrology or inspection device for determining properties of structures on a substrate. The invention also relates to a method for determining properties of structures on a substrate. Background technique [0004] A lithographic apparatus is a machine configured to apply a desired pattern onto a substrate. Lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). A lithographic apparatus can, for example, project a pattern (also often referred to as a "design layout" or "design") at a patterning device (such as a mask) onto a radiation-s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
CPCG06T7/0006G06T7/001G06N3/08G01N21/49G01N21/84G03F1/38G03F7/70616G03F7/7065G03F7/70625G03F7/70633G03F7/70641G03F7/70683G06T2207/20081G06T2207/20084G06T2207/30148G01B11/02G01B2210/56G01N21/55
Inventor L·特里波迪帕特里克·华纳G·格热拉M·哈伊赫曼达F·法哈德扎德P·A·J·廷尼曼斯S·A·米德尔布鲁克斯安卓尼斯·科内利斯·马修斯·科普曼弗兰克·斯塔尔斯布伦南·彼得森A·B·范奥斯汀
Owner ASML NETHERLANDS BV
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