Thermoelectric refrigeration method for chip-level electronic equipment

Abstract

The invention discloses a thermoelectric refrigeration method for chip-level electronic equipment, and aims to provide a thermoelectric refrigeration method which is high in heat dissipation efficiency and capable of removing chip hot spots. According to the technical scheme, under the conditions of a P-type semiconductor chip and power supply, N bow-shaped wave connection refrigeration sheet current-conducting plates are horizontally placed on the inner side walls of a heat sink of a heat dissipation plate and a heat conductor refrigeration panel at intervals in a staggered mode, the cold surface of the heat conductor refrigeration panel makes close contact with the chip through a heat interface material, heat of the chip is absorbed, and the heat conductor heat dissipation panel is in close contact with the next-stage heat sink mounting surface; a P-type semiconductor chip and an N-type semiconductor chip are vertically and fixedly connected to two ends of the arch-shaped wave connection refrigeration sheet conductive plate to form a P-type semiconductor material and an N-type semiconductor material which have different polarities and are connected to form a galvanic couple pair;heat is released in an integrated form of the bow-shaped wave connection thermoelectric refrigeration sheet of the multi-stage series couple pair and the chip-level electronic equipment, and is dissipated through the next-stage heat sink.

Description

technical field [0001] The invention relates to a chip heat dissipation technology in an electronic packaging device, in particular to a thermoelectric refrigeration method for chip-level electronic equipment. Background technique [0002] As electronic components continue to shrink in size and increase in speed and performance, chip-level electronics consume more power and heat flux. Excessive temperature will cause the components to bear excessive thermal expansion stress, resulting in the destruction of their structure and failure. According to statistics, more than 55% of electronic equipment failures are due to the increase in temperature, and the failure rate of electronic components increases exponentially. , which reduces the reliability of electronic equipment to varying degrees. Since the emergence of silicon integrated circuits, the integration of transistors in electronic equipment has increased by several orders of magnitude. Correspondingly, the heat generated...

AI Technical Summary

Problems solved by technology

Due to the limitation of the performance of thermoelectric materials and the complexity of factors affecting the performance of thermoelectric cooling systems, the research on the application of thermoelectric cooling technology in the thermal management of microelectronic packaging has been slow.

The research on the heat transfer characteristics and application performance of the thermoelectric cooling system for thermoelectric cooling technology is not deep enough and perfect.

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