Machining and welding method for chip packaging detection equipment rack

A technology for testing equipment and chip packaging, which is applied in the field of chip welding, can solve the problems of not being able to detect welding problems in time, reduce the welding quality of the frame, and unfavorable the use of frame welding, so as to facilitate the use of welding, improve the quality of welding, and improve the quality. Effect

Pending Publication Date: 2021-01-22
苏州航菱微精密组件有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing processing and welding method for the frame of chip packaging and testing equipment, in the process of welding the frame, has a poor cleaning effect on the plate of the frame, which affects the welding quality of the frame, and lacks the detection of the weld seam of the frame, resulting

Method used

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  • Machining and welding method for chip packaging detection equipment rack

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Effect test

Embodiment 1

[0030] see figure 1 , the present invention provides a technical solution: a chip packaging and testing equipment frame processing and welding method, comprising the following steps:

[0031] S1. Prepare the materials required for welding the frame;

[0032] S2, cutting the frame plate;

[0033] S3, polishing and cleaning the plates required for the welding frame;

[0034] S4, cleaning the polished rack plate;

[0035] S5, drying the cleaned rack plate;

[0036] S6, clamping and fixing the frame plate;

[0037] S7, welding the frame plate;

[0038] S8, detecting the welded part of the frame plate;

[0039] S9, spraying the welded frame.

[0040] In this embodiment, specifically: in S1, prepare the plates, polishing liquid, spraying liquid and welding equipment used for welding the frame; prepare the materials used for welding in advance, so as to improve the efficiency of welding the frame.

[0041] In this embodiment, specifically: in S2, the plate used for the weldin...

Embodiment 2

[0050] see figure 1 , the present invention provides a technical solution: a chip packaging and testing equipment frame processing and welding method, comprising the following steps:

[0051] S1. Prepare the materials required for welding the frame;

[0052] S2, cutting the frame plate;

[0053] S3, polishing and cleaning the plates required for the welding frame;

[0054] S4, cleaning the polished rack plate;

[0055] S5, drying the cleaned rack plate;

[0056] S6, clamping and fixing the frame plate;

[0057] S7, welding the frame plate;

[0058]S8, detecting the welded part of the frame plate;

[0059] S9, spraying the welded frame.

[0060] In this embodiment, specifically: in S1, prepare the plates, polishing liquid, spraying liquid and welding equipment used for welding the frame; prepare the materials used for welding in advance, so as to improve the efficiency of welding the frame.

[0061] In this embodiment, specifically: in S2, the plate used for the welding...

Embodiment 3

[0070] see figure 1 , the present invention provides a technical solution: a chip packaging and testing equipment frame processing and welding method, comprising the following steps:

[0071] S1. Prepare the materials required for welding the frame;

[0072] S2, cutting the frame plate;

[0073] S3, polishing and cleaning the plates required for the welding frame;

[0074] S4, cleaning the polished rack plate;

[0075] S5, drying the cleaned rack plate;

[0076] S6, clamping and fixing the frame plate;

[0077] S7, welding the frame plate;

[0078] S8, detecting the welded part of the frame plate;

[0079] S9, spraying the welded frame.

[0080] In this embodiment, specifically: in S1, prepare the plates, polishing liquid, spraying liquid and welding equipment used for welding the frame; prepare the materials used for welding in advance, so as to improve the efficiency of welding the frame.

[0081] In this embodiment, specifically: in S2, the plate used for the weldin...

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PUM

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Abstract

The invention discloses a machining and welding method for a chip packaging detection equipment rack. The machining and welding method comprises the following steps that S1, materials needed for welding the rack are prepared; S2, a rack plate is cut; S3, the plate needed for welding the rack is polished and cleaned; S4, the polished rack plate is cleaned; S5, the cleaned rack plate is dried; S6, the rack plate is clamped and fixed; S7, the rack plate is welded; S8, the welding position of the rack plate is detected; and S9, the welded rack is sprayed. In the using process of the machining andwelding method, the rack plate is cleaned through a polishing solution and ultrasonic cleaning equipment, and therefore the welding quality of the rack is improved; and a welding line of the rack is detected through welding line damage detection equipment based on spectral information, and therefore the welding problem generated in the rack welding process can be found in time, the welding problemis solved in time, the rack welding quality is improved, and welding use of the rack is facilitated.

Description

technical field [0001] The invention relates to the technical field of chip welding, in particular to a method for processing and welding a frame of chip packaging and testing equipment. Background technique [0002] The shell used to install the semiconductor integrated circuit chip plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, and it is also a bridge to communicate the internal world of the chip with the external circuit - the contacts on the chip are connected to the packaging shell with wires On the pins, these pins are connected to other devices through the wires on the printed board. Therefore, packaging plays an important role for CPUs and other LSI integrated circuits, and chip packaging and testing equipment is supported by racks. [0003] The existing processing and welding method for the frame of chip packaging and testing equipment, in the process of welding the frame, has a poor cleaning effect on ...

Claims

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Application Information

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IPC IPC(8): B23P15/00
CPCB23P15/00
Inventor 胡志华何平
Owner 苏州航菱微精密组件有限公司
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