Flat heat pipe type CPU heat dissipation device based on thermoelectric refrigeration
A thermoelectric refrigeration and heat dissipation device technology, applied in electrical digital data processing, instruments, digital data processing components, etc., can solve the problems of moisture on the main board, potential safety hazards, short circuits, etc., to achieve compact and compact equipment, maintain safe operation, and control temperature. liter effect
Pending Publication Date: 2021-01-22
DALIAN UNIV OF TECH
View PDF3 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, the problem of frosting at the cold end limits the application of thermoelectric cooling chips on the CPU. Frosting at the cold end leads to many safety hazards such as: motherboard damp, short circuit, etc.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0032] The specific implementation manners of the present invention will be further described below in conjunction with the accompanying drawings and technical solutions.
[0033] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. However, it should be understood that these descriptions are only for further illustrating the features and advantages of the present invention, rather than limiting the claims of the present invention.
[0034] The invention discloses a flat heat pipe CPU cooling device based on thermoelectric refrigeration, which is characterized in that the flat heat pipe CPU cooling device for thermoelectric cooling includes: CPU1, flat heat pipe 2 with grooves, thermoelectric cooling sheet 3, heat dissipation Fins 4, cooling fan 5; when CPU1 is in working condition, the temperature of its surface rises, and CPU1 is closely attached to the surface o...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention belongs to the technical field of CPU heat dissipation, and provides a flat heat pipe type CPU heat dissipation device based on thermoelectric refrigeration. Heat generated by the CPU inthe working process is transmitted to the cold end of the thermoelectric refrigeration sheet through the flat heat pipe with the groove in the surface, then the heat is transmitted to the external environment in a forced convection mode through the cooling fins installed at the hot end of the thermoelectric refrigeration sheet, the temperature of the CPU is effectively controlled, and the power upper limit of the CPU is increased. Compared with a traditional CPU heat dissipation mode, the CPU heat dissipation device has the following advantages that heat generated when the CPU works is diffused through the flat plate heat pipes, and the heat flux density of the CPU is reduced; by changing the structure of the flat heat pipe, the contact between the cold end of the thermoelectric refrigeration sheet and air is avoided, and the frosting problem of the cold end is eliminated; the thermoelectric refrigeration system is adopted to dissipate heat of the CPU, the structure is simple, and thetemperature is easy to control.
Description
technical field [0001] The invention belongs to the technical field of CPU heat dissipation, and in particular relates to a flat heat pipe type CPU heat dissipation device based on thermoelectric refrigeration. Background technique [0002] With the rapid development of integrated circuit technology, the performance and power of the CPU are gradually improved, and the size is getting smaller and smaller. Therefore, it is necessary to effectively dissipate heat from the CPU components with high heat flux, otherwise the CPU power will be limited, and in severe cases, the CPU will be damaged. damaged. As the user's demand for CPU performance continues to increase, the overall layout of the chassis is gradually becoming compact. Therefore, designing an efficient and compact CPU cooling device is a necessary condition to break through the CPU performance limit and improve computer performance. [0003] At present, there are active heat dissipation and passive heat dissipation fo...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/202
Inventor 刘轩羽白敏丽李洋
Owner DALIAN UNIV OF TECH