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A method for deglue of mixed press PCB

A glue residue and the same technology, applied in the field of PCB production, can solve the problems of inexhaustible glue removal, excessive glue removal of easy-to-remove materials, unreliable connection, etc., and achieve the effect of fully removing glue and improving the effect of glue removal.

Active Publication Date: 2021-10-26
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Specifically, when two materials with significantly different levels of glue removal are mixed and pressed into a PCB, glue slag is formed on the hole wall after drilling. Specifically, the PCB will generate instantaneous high temperature when drilling, and the substrate (commonly FR-4) or the resin material used to connect the copper layers is a poor conductor, and the heat will be highly accumulated during drilling, and the surface temperature of the hole wall will melt when the temperature of the hole wall exceeds the glass transition temperature of the resin. Flow, thus forming a thin layer of slag, the slag is not the burrs and burrs drilled by mechanical drilling, the slag is mainly hydrocarbons, if the slag is not removed, it will make the inside of the multi-layer board The layer signal line is not connected, or the connection is unreliable, so glue removal is required. At present, the industry generally uses the same glue removal method to remove glue, but in the process of glue removal, the glue removal parameters (same glue remover, same glue removal Concentration, degumming time and other parameters) cannot match the desmearing effect of the two materials well at the same time. When the degumming parameters of the easy-to-remove material are selected, it is easy to cause the pore wall of the difficult-to-remove material to be inexhaustible. Using the degumming parameters of difficult-to-remove materials may easily cause excessive degumming of easy-to-remove materials. Even through conventional degumming parameter optimization, the goal of simultaneous and sufficient degumming cannot be achieved.

Method used

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  • A method for deglue of mixed press PCB
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  • A method for deglue of mixed press PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Embodiment 1, the method of drilling after filling is adopted.

[0030] see figure 2 , firstly, after drilling, use two resins with different difficulty in removing glue to control the depth of the through hole 14, fill the hole section corresponding to the first material 11 with the first resin 15, and fill the hole section corresponding to the second material 12 Section filling second resin 17; The first resin is easy to remove glue resin, and the second resin is difficult to remove glue resin, in this step, first resin 15 or second resin 17 plug hole depths are realized by debugging plug hole parameters, as by Adjust the pressure and time of the plug hole to control the depth of the plug hole, or provide a screen first, and the screen is formed with protrusions corresponding to the size of the hole segment corresponding to the first material 11, and pass through the protrusions of the screen when controlling the depth of the plug Block the corresponding hole sectio...

Embodiment 2

[0033] Embodiment 2, the method of controlling the deep plug ink ring through the oil retaining point of the plug hole.

[0034] see Figure 4 , after drilling the through hole 14, set screen plates with different sizes of oil retaining parts at both ends of the through hole 14, and use different resins to plug the holes respectively; so that in the hole sections corresponding to the first material 11 and the second material 12 Resin with a certain thickness is respectively attached to the inner wall of the second material 12, and the thickness of the second resin in the hole section corresponding to the second material 12 is greater than the first resin thickness in the hole section corresponding to the first material 11, so as to ensure that the same degumming method is adopted When the first material 11 corresponds to the time of desmearing of the hole section+the time of removing the first resin 15 on the corresponding hole section of the first material 11=the time of desm...

Embodiment 3

[0037] Embodiment 3, by controlling the depth of plugging photosensitive resin, exposing and developing.

[0038] The specific plugging process is as follows: two kinds of photosensitive inks are used to plug the through hole 14, and the through hole 14 is deeply plugged with photosensitive resin; the hole section corresponding to the first material is inserted into the first photosensitive ink, and the corresponding hole section of the second material The second photosensitive ink is placed in the hole segment, and then the photosensitive ink after plugging the hole is exposed, wherein the exposure compensation value of the first material 11 corresponding to the hole segment to the first photosensitive ink is smaller than that of the second material 12 corresponding to the hole segment to the second photosensitive ink Exposure compensation value; after exposure and development, because the exposure compensation value of the photosensitive ink in the hole segment corresponding ...

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Abstract

The present invention provides a deglue method for mixed pressure PCB, comprising the following steps: S1: different types of materials are mixed and pressed to make PCB, wherein the different types of materials include first material and second material with different difficulty in degumming, The glue removal difficulty of the first material is more difficult than that of the second material; S2: Drill through holes on the laminated PCB, and the hole walls of the hole sections corresponding to the first material and the second material in the through holes are respectively Slag is formed; S3: Two resins with different difficulty in removing glue are used to form on the hole wall of the through hole, and the first resin is formed on the hole wall of the hole section corresponding to the first material, and the hole section corresponding to the second material is formed on the wall of the through hole. The second resin is formed on the hole wall; S4: Use the same degumming method to fully remove the resin and scum on the hole sections corresponding to the first material and the second material at the same time. The glue-removing manufacturing method of the mixed-pressure PCB of the present invention can simultaneously remove glue from different types of materials and improve the glue-removing effect.

Description

technical field [0001] The invention relates to the technical field of PCB production, in particular to a deglue method for a mixed-press PCB. Background technique [0002] With the rapid development of 5G communication technology, the demand for materials by end customers is increasing, and the functional requirements for materials are also becoming more and more abundant. At present, the mixed pressure of high-speed materials and FR4 materials, the mixed pressure of high-speed materials and high-frequency materials, and the mixed pressure of high-speed materials and functional materials are widely used in PCB manufacturing. Due to the significant difference in the ease of degumming of different types of materials, the control of the amount of degumming on the hole wall after drilling the PCB with mixed-pressure structure has always been a difficult point that technology research wants to break through. Specifically, when two materials with significantly different levels o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/26
CPCH05K3/0047H05K3/0055H05K3/26
Inventor 刘梦茹彭伟宋清李恢海唐海波韦进峰纪成光
Owner DONGGUAN SHENGYI ELECTRONICS