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High-thermal-conductivity high-strength copper alloy heat conduction pipe for electronic products

A technology with high thermal conductivity and electronic products. It is applied in the fields of modification through conduction and heat transfer, electrical components, and structural parts of electrical equipment. and other issues, to achieve the effect of good thermal conductivity, good plasticity, and efficient heat dissipation

Pending Publication Date: 2021-01-26
太仓巧洲五金科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the implementation process of the present invention, it is found that the various types of copper alloy heat pipes provided by the prior art are difficult to balance in terms of thermal conductivity, mechanical properties, stability, etc., and at the same time, the configuration design of the heat pipes also needs to be improved

Method used

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  • High-thermal-conductivity high-strength copper alloy heat conduction pipe for electronic products

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A high-thermal-conductivity high-strength copper alloy heat pipe for electronic products, comprising the following components by mass percentage:

[0039] Cr, 0.5%;

[0040] Ni, 0.26%;

[0041] Zr, 0.05%;

[0042] Nb, 0.03%;

[0043] Mg, 0.06%;

[0044] Fe, 0.04%;

[0045] Sn, 0.01%;

[0046] Ag, 0.01%;

[0047] Rh, 0.05%;

[0048] Ce, 0.04%;

[0049] P, 0.02%;

[0050] Cu, balance.

[0051] In this embodiment, the heat pipe is prepared by smelting, casting, extrusion, water cooling, and aging treatment. Specifically, the ingredients are prepared according to the ratio of each component. After the ingredients are melted and cast at a high temperature, a long billet with a circular cross-section is formed. The billet is extruded in a mold to form a pipe with a specific cross-sectional shape. The finished heat pipe is obtained through water cooling and aging treatment.

[0052] In this embodiment, the melting temperature is within the range of 1180°C; the extr...

Embodiment 2

[0055] A high-strength copper alloy heat pipe with high thermal conductivity for electronic products, comprising the following components by mass percentage:

[0056] Cr, 0.8%;

[0057] Ni, 0.2%;

[0058] Zr, 0.4%;

[0059] Nb, 0.05%;

[0060] Mg, 0.07%;

[0061] Fe, 0.08%;

[0062] Sn, 0.03%;

[0063] Ag, 0.05%;

[0064] Rh, 0.01%;

[0065] Ce, 0.12%;

[0066] P, 0.03%;

[0067] Cu, balance.

[0068] In this embodiment, the heat pipe is prepared by smelting, casting, extrusion, water cooling, and aging treatment. Specifically, the ingredients are prepared according to the ratio of each component. After the ingredients are melted and cast at a high temperature, a long billet with a circular cross-section is formed. The billet is extruded in a mold to form a pipe with a specific cross-sectional shape. The finished heat pipe is obtained through water cooling and aging treatment.

[0069] In this embodiment, the melting temperature is within the range of 1230°C; the e...

Embodiment 3

[0072] A high-strength copper alloy heat pipe with high thermal conductivity for electronic products, comprising the following components by mass percentage:

[0073] Cr, 0.65%;

[0074] Ni, 0.23%;

[0075] Zr, 0.24%;

[0076] Nb, 0.042%;

[0077] Mg, 0.06%;

[0078] Fe, 0.05%;

[0079] Sn, 0.026%;

[0080] Ag, 0.02%;

[0081] Rh, 0.04%;

[0082] Ce, 0.07%;

[0083] P, 0.02%;

[0084] Cu, balance.

[0085] In this embodiment, the heat pipe is prepared by smelting, casting, extrusion, water cooling, and aging treatment. Specifically, the ingredients are prepared according to the ratio of each component. After the ingredients are melted and cast at a high temperature, a long billet with a circular cross-section is formed. The billet is extruded in a mold to form a pipe with a specific cross-sectional shape. The finished heat pipe is obtained through water cooling and aging treatment.

[0086] In this embodiment, the melting temperature is 1210°C; the extrusion temperat...

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Abstract

The invention belongs to the technical field of alloys and manufacturing, and particularly relates to a high-thermal-conductivity high-strength copper alloy heat conduction pipe for electronic products, which comprises the following components in percentage by mass: 0.5-0.8% of Cr; 0.2-0.26% of Ni; 0.05-0.4% of Zr; 0.03-0.05% of Nb; 0.06-0.07% of Mg; 0.04-0.08% of Fe; 0.01-0.03% of Sn; 0.01-0.05%of Ag; 0.01-0.05% of Rh; 0.04-0.12% of Ce; 0.02-0.03% of P; with the balance being Cu. The sum of the mass percent of Ag and the mass percent of Rh is within the range of 0.06 + / -0.002. The copper alloy heat conduction pipe is good in stability, high in mechanical strength, good in heat conduction effect, good in plasticity, simple in preparation process and economical in comprehensive cost, cooling liquid or volatile heat conduction media can be filled in the pipe, and the copper alloy heat conduction pipe is suitable for efficient heat dissipation of various electronic products.

Description

technical field [0001] The invention belongs to the field of alloy and manufacturing technology, and more specifically relates to a high-strength copper alloy heat-conducting tube with high thermal conductivity for electronic products. Background technique [0002] With the rapid development of the technology industry, all kinds of electronic products are becoming more and more integrated, and their functions are becoming more and more complex. At the same time, the problem of heat dissipation of various heating elements has become more and more prominent, which has become one of the main constraints to further improve the performance of electronic products. Electronic components are usually relatively fragile, and insufficient heat dissipation can easily lead to damage to electronic components. The heat pipe is a basic component commonly used in various heat dissipation devices, and its interior can be filled with a heat-conducting medium to realize rapid heat transfer. D...

Claims

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Application Information

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IPC IPC(8): H05K7/20C22C9/00
CPCC22C9/00H05K7/20509H05K7/20327
Inventor 李建红
Owner 太仓巧洲五金科技有限公司
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