Hybrid integrated circuit aging test tool and method
A hybrid integrated circuit and aging technology, applied in the field of component reliability testing, can solve the problems of large power dissipation, large volume, power consumption and heat dissipation, etc., and achieve the effect of improving heat dissipation, good versatility, and good heat dissipation
Pending Publication Date: 2021-01-29
BEIJING ZHENXING METROLOGY & TEST INST
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Problems solved by technology
The conventional fixture adopts the locking seat method, which has poor effective contact and protection for the device pins
High-power hybrid integrated circuits consume power to dissipate heat during the test. If the heat cannot be effectively dissipated, the device will be damaged.
[0003] Patents CN102435876A, CN202113034U, and CN204989229U provide fixtures or test sockets that use metal spring probes to test chips. This type of chip test fixture is suitable for monolithic integrated circuits, and one fixture can only be used for a single chip test, which has poor versatility; and For hybrid integrated circuits with large volume, thick metal pins, irregular arrangement, and large power dissipation, this type of chip test fixture cannot be applied
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[0023] The invention provides a hybrid integrated circuit burn-in test tool, which includes a burn-in board, a bearing board, a device fixing structure and a test structure, the burn-in board and the bearing board are fixed in parallel, there is a certain gap between them, the device fixing structure and the The structure is installed on the bearing plate, the test structure is symmetrically distributed on both sides of the device fixing structure, and the device fixing structure fixes the device to be tested.
[0024] The test structure includes testing the first fixed carrier board, testing the second fixed carrier board, probe structure, frame locking structure and mobile carrier board, testing the first fixed carrier board and testing the second fixed carrier board are fixedly installed on the carrier board, The frame locking structure is installed on the carrier board, and is used for positioning the mobile carrier board in the testing position and the non-testing position...
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The invention provides a hybrid integrated circuit aging test tool and method. The test tool comprises an aging plate, a bearing plate, a device fixing structure and test structures, the aging plate and the bearing plate are fixed in parallel, a certain gap exists between the aging plate and the bearing plate, the device fixing structure and the test structures are installed on the bearing plate,and the test structures are symmetrically distributed on the two sides of the device fixing structure. The device fixing structure fixes a to-be-tested device. The special test structure is adopted, ametal spring probe is in flexible contact with a device pin, and the damage to the pin is avoided while effective contact with the device pin is guaranteed.
Description
technical field [0001] The invention relates to a hybrid integrated circuit burn-in test tool and method, and belongs to the technical field of component reliability testing. Background technique [0002] At present, most of the hybrid integrated circuit aging equipment is integrated with various instruments and instrumentation systems such as power supplies and electronic loads. The pin arrangement, number and thickness of hybrid integrated circuit devices are inconsistent, and the fixtures lack standardization and generalization. The conventional fixture adopts the locking seat method, which has poor effective contact and protection for the device pins. High-power hybrid integrated circuits consume power to dissipate heat during the test. If the heat cannot be effectively dissipated, the device will be damaged. [0003] Patents CN102435876A, CN202113034U, and CN204989229U provide fixtures or test sockets that use metal spring probes to test chips. This type of chip test ...
Claims
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Login to View More IPC IPC(8): G01R31/28
CPCG01R31/2863G01R31/2887
Inventor 温恒娟陈覃李骥尧
Owner BEIJING ZHENXING METROLOGY & TEST INST