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Cutting device and cutting method for large-size single-crystal round rod

A cutting device and cutting method technology, which is applied to fine working devices, stone processing equipment, manufacturing tools, etc., can solve the problems of affecting the processing speed, single crystal breakage at the position of the knife, affecting the processing efficiency, etc., and improve product qualification. rate, reduce the probability of breakage, and improve the effect of processing efficiency

Pending Publication Date: 2021-02-02
INNER MONGOLIA ZHONGHUAN SOLAR MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Existing methods for cutting silicon rods, especially when cutting single-wafer rods into squares, all use the knife from the side of the round rod, such as figure 1 As shown, there will be a phenomenon of single crystal breakage after cutting and the increase of the wire bow will affect the cutting efficiency. If the breakage is too large, it cannot be removed by grinding, which will reduce the overall quality and output of silicon rods.
Especially for the squaring process of large-scale single-wafer rods, due to the larger size of the silicon rod, the weight of the corresponding cut-off skin will be heavier, and the probability of breakage will be higher.
[0003] At present, the diameter of round rods processed by integrated machining is less than 230mm, and the method of cutting from the side of the round rod is adopted. If the large-diameter round rod single crystal (diameter is 230-310mm) is processed, it is still cut from the side, which will cause Diamond wire cutting to the end, when the knife is out, due to the large size of the edge of the single crystal, it will cause the breakage of the single crystal at the position of the knife, resulting in unqualified large-size single crystal processing
And the contact length of the diamond wire is the length of the single crystal silicon rod, which will lead to a large contact area between the diamond wire and the single crystal, and the wire bow will also become larger, which will affect the overall processing speed and thus affect the processing efficiency.

Method used

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  • Cutting device and cutting method for large-size single-crystal round rod
  • Cutting device and cutting method for large-size single-crystal round rod
  • Cutting device and cutting method for large-size single-crystal round rod

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] A large-size single-wafer rod cutting device, the cutting chamber is equipped with a "well"-shaped diamond wire, and the "well"-shaped diamond wire is set at one end of the single-wafer rod and parallel to the end face of the single-wafer rod; "well" The font diamond wire includes warp and weft arranged in front and back. The warp is in front and the weft is in the back. There are two warp and weft. The bottom surface and the two ends of the weft thread are respectively connected to the weft thread sheaves. The weft thread sheaves are respectively arranged on the left and right sides of the cutting chamber wall. The four sides of the cutting chamber wall are provided with sheave screw screws. on the wheel screw. The inner wall of the cutting chamber is provided with a strip clamping device, which includes four strip clamping devices, and the four strip clamping devices respectively correspond to the four strips obtained by cutting a single wafer bar, and each strip clam...

Embodiment 2

[0057] A large-size single-wafer rod cutting method, the specific steps are as follows:

[0058] Step 1 Loading and clamping and fixing the large-size single wafer rod; use the robot to grab the large-size single crystal (round rod diameter 230-310mm), and then load the material, and use the fixed suction cup to tighten after loading to ensure that the silicon rod firmly fixed;

[0059] Step 2 Move the manipulator so that the cylinder clamps the position of the edge; use a small cylinder to tighten the edge to avoid damage to the silicon rod when the edge falls due to unclamping, and affect the quality of the large-size square rod;

[0060] Step 3 Use the measuring probe to detect the diameter and crystal wire of the single wafer rod to ensure that the large diameter rod can meet the equipment processing requirements;

[0061] In step 4, the "well"-shaped diamond wire enters from the end face of the single-wafer rod, and the single-wafer rod is cut in sections. The feed speed...

Embodiment 3

[0065] A large-size single-wafer rod cutting method, the specific steps are as follows:

[0066] Step 1 Loading and clamping and fixing the large-size single wafer rod; use the robot to grab the large-size single crystal (round rod diameter 230-310mm), and then load the material, and use the fixed suction cup to tighten after loading to ensure that the silicon rod firmly fixed;

[0067] Step 2 Move the manipulator so that the cylinder clamps the position of the edge; use a small cylinder to tighten the edge to avoid damage to the silicon rod when the edge falls due to unclamping, and affect the quality of the large-size square rod;

[0068] Step 3 Use the measuring probe to detect the diameter and crystal wire of the single wafer rod to ensure that the large diameter rod can meet the equipment processing requirements;

[0069] In step 4, a "well"-shaped diamond wire is used to enter from the end face of the single-wafer rod, and the single-wafer rod is cut in sections. The fe...

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Abstract

The invention relates to a cutting device for a large-size single-crystal round rod. The cutting device for the large-size single-crystal round rod is characterized in that a #-shaped diamond wire isarranged in a cutting chamber, and the #-shaped diamond wire is arranged at one end of the single-crystal round rod and is parallel to the end surface of the single-crystal round rod; four edge skin clamping devices are arranged on the inner wall of the cutting chamber and correspond to four edge skins obtained by cutting the single-crystal round rod separately; and during cutting, the single-crystal round rod is cut at one end of the single-crystal round rod in the axis direction of the single-crystal round rod through the #-shaped diamond wire. The cutting device for the large-size single-crystal round rod has the following beneficial effects: the #-shaped diamond wire is adopted for cutting from the end surface of the round rod, the contact area of the diamond wire and single crystal issmall, and a wire bow is small, so that the machining efficiency for the silicon rod can be increased; and a sectional type cutting mode is adopted, and the cut edge skins are fixed by matching withedge skin clamps, so that the breakage probability of the silicon rod can be effectively reduced, the surface quality of the single-crystal silicon rod can be effectively improved, and the product percent of pass is increased.

Description

technical field [0001] The invention belongs to the technical field of silicon rod cutting, and in particular relates to a large-size single wafer rod cutting device and a cutting method. Background technique [0002] Existing methods for cutting silicon rods, especially when cutting single-wafer rods into squares, all use the knife from the side of the round rod, such as figure 1 As shown, there will be a phenomenon of single crystal breakage after cutting and the wire bow will become larger to affect the cutting efficiency. If the breakage is too large, it cannot be removed by grinding, which will reduce the overall quality and yield of silicon rods. Especially in the squaring process of large-scale single-wafer rods, due to the larger size of the silicon rod, the weight of the corresponding cut-off skin will be heavier, and the probability of breakage will be higher. [0003] At present, the diameter of round rods processed by integrated machining is less than 230mm, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/00B28D5/04
CPCB28D5/0076B28D5/0082B28D5/04
Inventor 匡文军史彦龙马洋高润飞谷守伟徐强
Owner INNER MONGOLIA ZHONGHUAN SOLAR MATERIAL