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power management chip

A technology of power management chip and integrated power supply, which is applied in the direction of electrical components, adjustment of electric variables, and output power conversion devices, etc. It can solve the problems of subsystem power consumption, complex system implementation, and inability to obtain the best performance output capability, etc., to achieve Meet the effect of miniaturization and simple structure

Active Publication Date: 2021-09-24
SHANGHAI XINLONG SEMICON TECH CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In traditional ultra-high-power power system applications, the vast majority of high-power power system application solutions are multiple small and medium-power power systems connected in parallel to form an overall power system, which needs to use bus communication with each other, and the system needs an equalization algorithm Or the chip can balance the output current to avoid local overheating. At the same time, because multiple subsystems are connected in parallel, the subsystems will still consume power at light loads. The system may also need a Hall current sensor to monitor the bus current in real time, requiring a microprocessor. Calculate and correct the data of the Hall current sensor to adjust the status and functions of each sub-power system. Local areas cannot obtain the best performance and maximum power output capability, and cannot meet the requirements of electronic equipment for miniaturization, portability, and lightweight transformation of ultra-high-power power supplies

Method used

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Embodiment Construction

[0026] The technical solutions in the embodiments of the present invention will be apparent from the drawings in the embodiment of the present invention. Obviously, the described embodiments are merely embodiments of the invention, not all of the embodiments. Based on the embodiments of the present invention, those skilled in the art are in the range of the present invention in the scope of the present invention without making in the pre-creative labor pre-.

[0027] Specifically, see figure 1 As shown, an embodiment of the present invention provides a power management chip 100 including: phase logic voltage unit 106, at least three integrated power management unit 110, and multi-function configuration pins (not marked).

[0028] The phase logic voltage unit 106 is configured to output at least three phase control signals.

[0029] Each of the integrated power management units 110 connects the phase logic voltage unit 106, each of the integrated power management units 110 blocks c...

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Abstract

The invention provides a power management chip, which includes: a phase logic voltage unit, at least three integrated power management units and multifunctional configuration pins. The power management chip is applied to a step-down power conversion circuit. When configured as a parallel output, multiple integrated power management units connected in parallel are controlled by the phase logic voltage unit to supply power for the same load in parallel, wherein each integrated power management unit can also be Configured as an independent working mode, the present invention satisfies the demands of high-power loads by controlling the integrated power management unit in different working modes and different application conditions. In addition, the power management chip has flexible configuration and simple peripheral structure, and can meet the requirements of miniaturization, portability, and lightweight transformation.

Description

Technical field [0001] The present invention relates to the technical field of high power chips, and more particularly to an integrated power management unit of an integrated power management unit. Background technique [0002] With the rapid advancement and development of electronic technology, electronic equipment is moving toward miniaturization, portability, lightweight, and more and more features of electronics, and therefore even more features in order to meet the growing diverse demand. Complex, product consumption is also getting more and more. Now the electronic equipment is moving toward miniaturization, portability, lightweight, and the spatial power management chip space of the electronic system gradually shrinks. How to reduce system high power supply module volume, how to reduce the complexity of high-power power module system, how to reduce High-power power module, how to reduce the number of peripheral high-power energy storage metades, reduce the design cost of l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02M3/158
CPCH02M3/1584H02M1/0009
Inventor 李瑞平陈博刘彬池伟
Owner SHANGHAI XINLONG SEMICON TECH CO LTD
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