power management chip
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANGHAI XINLONG SEMICON TECH CO LTD
- Publication Date
- 2021-09-24
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Abstract
Description
Technical field
[0001] The present invention relates to the technical field of high power chips, and more particularly to an integrated power management unit of an integrated power management unit. Background technique
[0002] With the rapid advancement and development of electronic technology, electronic equipment is moving toward miniaturization, portability, lightweight, and more and more features of electronics, and therefore even more features in order to meet the growing diverse demand. Complex, product consumption is also getting more and more. Now the electronic equipment is moving toward miniaturization, portability, lightweight, and the spatial power management chip space of the electronic system gradually shrinks. How to reduce system high power supply module volume, how to reduce the complexity of high-power power module system, how to reduce High-power power module, how to reduce the number of peripheral high-power energy storage metades, reduce the design cost of l...