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High-purity copper non-smelting casting method

A high-purity copper and casting technology, used in vacuum evaporation plating, coating, sputtering and other directions, can solve the problems of easy generation of impurities and mechanical stress in castings, and achieve prevention of oxidation, stress relief, and uniform heating. Effect

Pending Publication Date: 2021-02-05
广安市立正金属有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the above-mentioned deficiencies in the prior art, the present invention provides a non-smelting casting method for high-purity copper, which is simple and easy to operate, can produce castings with better quality, and effectively solves the problem of impurities easily produced in castings in the prior art. and problems such as mechanical stress

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A high-purity copper non-melting casting method, comprising the following steps:

[0020] (1) Trimming the 6N copper plate, then cutting the strips into strips with a width of 1 cm, and keeping the temperature at 300° C. for 1 hour to obtain copper strips;

[0021] (2) heating the copper strip obtained in step (1) for 1 h in an ammonia gas atmosphere at 1000° C. to obtain a billet;

[0022] (3) The billet obtained in step (2) is continuously extruded through a die under a pressure of 100 MPa to obtain a cast copper rod.

Embodiment 2

[0024] A high-purity copper non-melting casting method, comprising the following steps:

[0025] (1) Trimming the 6N copper plate, then cutting the strips into strips with a width of 1 cm, and keeping the temperature at 400° C. for 2 hours to obtain copper strips;

[0026] (2) heating the copper strip obtained in step (1) for 2 hours in an ammonia atmosphere at 1020° C. to obtain a billet;

[0027] (3) The billet obtained in step (2) is continuously extruded through a die under a pressure of 120 MPa to obtain a cast copper rod.

Embodiment 3

[0029] A high-purity copper non-melting casting method, comprising the following steps:

[0030] (1) Trimming the 6N copper plate, then cutting it into strips with a width of 2 cm, and keeping it warm for 2 hours at a temperature of 500° C. to obtain copper strips;

[0031] (2) heating the copper strip obtained in step (1) for 4 hours in an ammonia gas atmosphere at 1050° C. to obtain a billet;

[0032] (3) The billet obtained in step (2) is continuously extruded through a die under a pressure of 150 MPa to obtain a cast copper rod.

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PUM

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Abstract

The invention discloses a high-purity copper non-smelting casting method which comprises the following steps that (1) edge cutting and trimming are conducted on a 6N copper plate, then the 6N copper plate is cut into strips with the width being 1-2cm, heat preservation is performed for 1-3h at the temperature of 300-600 DEG C, and copper strips are obtained; (2) the copper strips are heated in anammonia atmosphere at the temperature of 1000-1100 DEG C for 1-7 hours to obtain blanks; and (3) the blanks are subjected to continuous extrusion forming through a die under the pressure of 100-200 MPa, a castings are obtained. The method is simple and easy to operate, the castings with high quality can be prepared, and the problems that in the prior art, castings are prone to containing impurities and have mechanical stress are effectively solved.

Description

technical field [0001] The invention relates to the technical field of high-purity copper casting mold preparation, in particular to a high-purity copper non-melting casting mold method. Background technique [0002] Sputtering technology is one of the commonly used technologies in the field of semiconductor manufacturing. With the increasing development of sputtering technology, sputtering targets play an increasingly important role in sputtering technology. The quality of sputtering targets directly affects the sputtering technology. Film quality after injection. [0003] In the field of sputtering target manufacturing, the target assembly is composed of a target blank that meets the sputtering performance and a back plate that is combined with the target blank by welding. In the sputtering process, the working environment of the target assembly is relatively bad. For example: the ambient temperature of the target assembly is relatively high. In addition, one side of the...

Claims

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Application Information

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IPC IPC(8): C23C14/34C22F1/08C22F1/02
CPCC23C14/3414C22F1/08C22F1/02
Inventor 郑正冯勇严雪松
Owner 广安市立正金属有限公司
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