Integrated circuits, microphone assemblies and sensor systems
A technology of integrated circuits and micro-electromechanical systems, applied in the direction of sensors, sensor parts, electrostatic transducer microphones, etc., can solve problems such as limitation and distortion of microphone signals
Active Publication Date: 2022-03-18
KNOWLES ELECTRONICS INC
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
The compact size and battery source severely limit the use of transducer and sensor amplifier circuits (such as microphone amplifier circuits, accelerometer amplifiers, gyroscope amplifiers, maximum acceptable size and / or power consumption of pressure sensor amplification circuits, etc.)
[0005] Furthermore, such compact devices using microphones and microphone amplification circuits have relatively limited overload margins, which can lead to distorted or "clipped" amplified microphone signals, especially for the use of voltage-based amplifiers waiting for this device
Method used
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Embodiment Construction
[0018] figure 1 Shown is a top-level block diagram of an exemplary transconductance amplifier 604 suitable for integration or incorporation into various types of processing circuits to amplify or buffer signals from various types of sensors and transducers (especially is the signal of a capacitive sensor such as a capacitive microphone transducer, piezoelectric transducer, etc.). Transconductance amplifier 604 may be fabricated on an integrated circuit, eg, using a CMOS semiconductor fabrication process. The skilled artisan will understand that the transconductance amplifier 604 may alternatively be used as a sensor amplifier for various types of sensors such as ultrasonic sensors, optical or piezoceramic accelerometers, strain gauge devices, and the like. These and other suitable sensors and transducers may be fabricated using microelectromechanical systems (MEMS) or other known or future technologies.
[0019] The transconductance amplifier 604 includes a first current fee...
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Abstract
The present disclosure relates to an integrated circuit, microphone assembly and sensor system. The present disclosure relates to an integrated circuit including a transconductance amplifier connectable to a microelectromechanical system (MEMS) transducer. A transconductance amplifier includes a first input coupled to a first current feeder and a second input coupled to a second current feeder to convert a single-ended or differential transducer signal voltage through a shared reference resistor into a signal representing The intermediate signal current of the transducer signal voltage. The transconductance amplifier also includes first and second output circuits coupled to the shared reference resistor and configured to convert the intermediate current signal to pass through the first output terminal and the second output circuit. The corresponding differential output current signal at the output terminals to drive the load.
Description
[0001] Cross references to related patent applications [0002] This application claims the benefit and priority of U.S. Provisional Patent Application No. 62 / 687,198, filed June 19, 2018, and U.S. Provisional Patent Application No. 62 / 690,863, filed June 27, 2018, the aforementioned U.S. Provisional Patent The entire disclosure of each of the applications is incorporated herein by reference. technical field [0003] The present application relates to an integrated circuit, microphone assembly and sensor system. Background technique [0004] Certain communication and computing devices, often portable, such as smartphones, smart speakers, IoT (Internet of Things) devices, mobile phones, tablets, etc., are compact devices that are typically powered by a rechargeable battery source. The compact size and battery source severely limit the use of transducer and sensor amplifier circuits (such as microphone amplifier circuits, accelerometer amplifiers, gyroscope amplifiers, maxim...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H04R3/00
CPCH04R3/00H04R2201/003H04R2499/11H03F3/45183H03F3/30H03F3/185B81B3/0021B81B2201/0257B81B2203/0127H04R19/04
Inventor J·厅格列夫C·E·富尔斯特
Owner KNOWLES ELECTRONICS INC