Multi-chip packaging module and method

Abstract

The invention provides a multi-chip packaging module, and the module comprises more than two chips which are chips with the back surfaces being ground and thinned; an intermediate plate which is provided with through holes corresponding to the pins of the more than two chips, wherein conductive metals are arranged in the through holes, and the more than two chips are arranged on the intermediate plate; and a metal layer which is arranged on the back surfaces of the more than one chip through electroplating, evaporation or deposition. According to the invention, the heat dissipation speed of the chip can be accelerated, the working temperature of the chip is reduced, and the working performance of the chip is ensured.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a multi-chip packaging module and method. Background technique [0002] The 2.5D packaging technology is to package chips of different sizes and functions on the same interposer substrate. Generally, such chips have high power consumption and relatively high power consumption density. The interface material of the heat sink usually uses thermal conductive silicone grease or indium sheet (cannot be soldered, just contact), and the thermal resistance is relatively large. In the application, a larger volume heat sink must be used. Therefore, a higher wind speed is required, and more energy consumption. In addition, due to the higher junction temperature of the chip, it is difficult to increase the main frequency. Especially when liquid cooling is used for heat dissipation, thermal grease cannot be used because the liquid is easy to contaminate, so an indium she...

AI Technical Summary

Problems solved by technology

The interface material of the heat sink usually uses thermal conductive silicone grease or indium sheet (cannot be soldered, just contact), and the thermal resistance is relatively large. In the application, a larger volume heat sink must be used. Therefore, a higher wind speed is required, and more energy consumption

In addition, due to the higher junction temperature of the chip, it is difficult to increase the main frequency. Especially when liquid cooling is used for heat dissipation, thermal grease cannot be used because the liquid is easy to contaminate, so an indium sheet must be used, but since the indium sheet and silicon are not the same phase medium , poor contact in liquid, the resulting heat dissipation problem is usually more difficult

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