Vacuum thermoplastic laminating process and equipment for achieving process

A bonding equipment, vacuum heating technology, applied in printed circuits, chemical instruments and methods, electrical components, etc., can solve problems such as height difference of bonding surface, residual air bubbles, limited effect, etc.

Pending Publication Date: 2021-02-26

TESA SE

7 Cites 0 Cited by

AI-Extracted Technical Summary

Problems solved by technology

[0003] The traditional hot pressing lamination process has disadvantages in the lamination of such products, that is, with the increase of the lamination area, air bubbles tend to remain in the middle of the...

Method used

It can be seen that the product obtained in the above-mentioned embodiment 2-8 is tested, and the vacuum thermoplastic laminating process of the present invention combines profiling hot pressing with vacuum defoaming, effectively minimizing the bubbles in the laminating process , Combined with the defoaming machine process, it can even achieve no bubbles, which effectively increases the bonding strength. The samples bonded by this process fully meet the standards in the flatness and functional multi-site capacitance tests.

The present inventor is through long-term and in-depth research, by preheating thermoplastic film, utilizes the heat and the weight of described preheated thermoplastic film to carry out thermocompression treatment and optional The advanced vacuum defoaming process can significantly improve the lamination effect of the obtained lamination products (basically no air bubbles remain in the lamination area, such as the air bubble residual rate can be zero), and the lamination process is...

Abstract

The invention relates to a vacuum thermoplastic laminating process and equipment for achieving the process. Specifically, by adopting the vacuum thermoplastic laminating process, heat and pressure canbe transferred by using a thermoplastic film, so that glue between to-be-laminated samples achieves a very good laminating effect.

Application Domain

LaminationLamination apparatus +1

Technology Topic

ThermoplasticPolymer chemistry +1

Image

Examples

Experimental program(8)
Comparison scheme(3)

Example Embodiment

[0121]Example 1 Laminating equipment

[0122]The main components (from top to bottom) of the laminating equipment of the present invention and their functioning modes are as follows:

[0123]1) Temperature control heating plate: The heat is generated by resistance, and the thermoplastic film is heated by heat radiation. The temperature control heating plate is supported and connected to the top of the device through two support columns connected to the base. The size of the heating zone of the temperature control heating plate is 32cm*28cm. The temperature of the temperature control heating plate is controlled by the control panel. The height of the pillar is 30 cm.

[0124]2) Thermoplastic film and film holder: After the thermoplastic film is heated to the set softening temperature, place the thermoplastic film on the base by holding the film holder. The film holder is movably connected to the two pillars supporting the temperature control heating plate, and its locking and movement can be manually adjusted. For convenience, the film holder is provided with a handle for moving the film holder, and the thermoplastic film is placed horizontally On the upper surface of the membrane support.

[0125]3) Sealing rubber: There is a sealing rubber at the bottom of the membrane holder to form a closed space.

[0126]4) Infrared temperature measuring probe: The infrared temperature measuring probe is fixed on the side of the base to monitor the heating process of the thermoplastic film. When the thermoplastic film reaches the set softening temperature, the vacuum pump is automatically turned on.

[0127]5) Base and control panel: The upper part of the base is a metal plate (34cm*29cm in size) with evenly punched holes, which is used to carry the mold; the control panel is used to start the program, set the temperature and vacuum.

[0128]6) Vacuum pump: When the thermoplastic film is put down and a closed space is formed, the vacuum pump draws out the air in the closed space to make the thermoplastic film and the mold profiling.

Example Embodiment

[0129]Example 2 Laminating process 1

[0130]1) Place the glue-containing samples that need to be bonded (including the upper bonding material anodized aluminum, tesa58484 and the lower bonding material polycarbonate in sequence) on the vacuum platform (that is, the evenly perforated metal plate, the thickness of the metal plate is 1mm, the hole distribution density is 16pcs/1cm2, The aperture is 1mm);

[0131]2) Install a thermoplastic film with a specific softening temperature (such as HIPS high-density polystyrene, 31cm*26cm in size, and a softening temperature of 130°C) on the fixture (ie film holder);

[0132]3) Set the infrared detection mold temperature parameter to 130 degrees, and the vacuum parameter is 0.2bar or 0.5bar or 0.9bar;

[0133]4) Pull up the thermoplastic film close to the heating surface (that is, the temperature control heating plate, set the heating temperature to 165°C), and heat the surface temperature of the thermoplastic film to the set 130 degrees by the heat conduction of the ceramic tube and air;

[0134]5) After the infrared detects that the temperature of the film surface reaches the set 130 degrees, the vacuum machine is turned on, and the thermoplastic film clamp is manually dropped onto the sample surface to form a closed vacuum environment;

[0135]6) The temperature carried by the film can be transferred to the plate and glue surface of the sample to activate the hot melt adhesive film, and the thermoplastic film can be cold molded into an irregular shape on the surface of the laminated material and conduct uniform heat; at the same time, the vacuum environment can effectively remove the paste The air bubbles on the joints enhance the bonding. In step 6), the surface temperature of the hot melt adhesive is 83°C, 90°C, 95°C, 100°C, and the action time is 20s, 30s or 40s.

[0136]Specific process referenceFigure 5 , Where a is a vacuum laminating machine, b is a PCB and Al touchpad, c is a vacuum laminating machine, and d is a notebook touchpad.

Example Embodiment

[0137]Example 3 Laminating process 2

[0138]Same as Example 2, the difference lies in: using high-temperature reaction glue, such as tesa 58474, etc., instead of the glue used in Example 2; and after step 6), it also includes a step: vacuum degassing treatment, the specific steps are as follows: step 6) The latter half-reacted glue-containing samples are thrown into the high-temperature deaerator to continue the pressure reaction to obtain better adhesion or other higher mechanical requirements.

PUM

Property	Measurement	Unit
Length	>= 4.0	cm
Height	10.0 ~ 40.0	cm
Softening temperature	130.0	°C

Description & Claims & Application Information

We can also present the details of the Description, Claims and Application information to help users get a comprehensive understanding of the technical details of the patent, such as background art, summary of invention, brief description of drawings, description of embodiments, and other original content. On the other hand, users can also determine the specific scope of protection of the technology through the list of claims; as well as understand the changes in the life cycle of the technology with the presentation of the patent timeline. Login to view more.