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Vacuum thermoplastic laminating process and equipment for achieving process

A bonding equipment, vacuum heating technology, applied in printed circuits, chemical instruments and methods, electrical components, etc., can solve problems such as height difference of bonding surface, residual air bubbles, limited effect, etc.

Pending Publication Date: 2021-02-26
TESA SE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional hot pressing lamination process has disadvantages in the lamination of such products, that is, with the increase of the lamination area, air bubbles tend to remain in the middle of the two lamination surfaces after lamination, resulting in high and low labor in different areas of the lamination surface. Poor, the simple defoaming machine process has limited effect on solving such problems

Method used

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  • Vacuum thermoplastic laminating process and equipment for achieving process
  • Vacuum thermoplastic laminating process and equipment for achieving process
  • Vacuum thermoplastic laminating process and equipment for achieving process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0121] Embodiment 1 Laminating equipment

[0122] The main components (from top to bottom) of the bonding equipment of the present invention and their mode of action are as follows:

[0123] 1) Temperature-controlled heating plate: The thermoplastic film is heated by means of heat radiation through resistance heating. The temperature-controlled heating plate is supported and coupled to the top of the device through two pillars coupled to the base. The size of the heating zone of the temperature control heating plate is 32cm*28cm. The temperature of the temperature-controlled heating plate is regulated through the control panel. The height of the pillars is 30cm.

[0124] 2) Thermoplastic film and film support: After the thermoplastic film is heated to the set softening temperature, the thermoplastic film is lowered to the base by holding the film support. The film support is movably connected to the two pillars supporting the temperature control heating plate, and its lock...

Embodiment 2

[0129] Embodiment 2 Bonding process 1

[0130] 1) Place the glue-containing samples that need to be bonded (including the upper bonding material anodized aluminum, tesa58484 and the lower bonding material polycarbonate in sequence) on the vacuum platform (that is, a uniformly perforated metal plate, the thickness of the metal plate 1mm, the hole distribution density is 16pcs / 1cm 2 , the hole diameter is 1mm);

[0131] 2) Install a thermoplastic film with a specific softening temperature (such as HIPS high-density polystyrene, the size is 31cm*26cm, and the softening temperature is 130°C) on the fixture (ie, the film holder);

[0132] 3) Set the infrared detection mold temperature parameter to 130 degrees, and the vacuum parameter to 0.2bar or 0.5bar or 0.9bar;

[0133] 4) Pull up the thermoplastic film close to the heating surface (that is, the temperature control heating plate, set the heating temperature to 165°C), and heat the surface temperature of the thermoplastic film...

Embodiment 3

[0137] Embodiment 3 Bonding process 2

[0138] Same as Example 2, the difference is: use high-temperature reactive glue such as tesa 58474 and other hot melt glue to replace the glue used in Example 2; and after step 6), it also includes a step: vacuum defoaming treatment, the specific steps are as follows: will go through step 6) The final semi-reacted rubber-containing sample is thrown into a high-temperature degassing machine to continue the pressurized reaction to obtain better adhesion or other higher mechanical requirements.

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Abstract

The invention relates to a vacuum thermoplastic laminating process and equipment for achieving the process. Specifically, by adopting the vacuum thermoplastic laminating process, heat and pressure canbe transferred by using a thermoplastic film, so that glue between to-be-laminated samples achieves a very good laminating effect.

Description

technical field [0001] The invention relates to the field of material processing, in particular to a vacuum thermoplastic bonding process and equipment for realizing the process. Background technique [0002] With the popularity of hot-melt adhesive bonding in large-size PCB board bonding applications, such as smart audio touch panels, notebook touch panels, etc., the customer's bonding strength, flatness, and follow-up functionality of the pasted samples are more Site capacitance testing has high demands. [0003] The traditional hot pressing lamination process has disadvantages in the lamination of such products, that is, with the increase of the lamination area, air bubbles tend to remain in the middle of the two lamination surfaces after lamination, resulting in high and low labor in different areas of the lamination surface. Poor, the simple degassing machine process has limited effect on solving such problems. Contents of the invention [0004] The object of the pr...

Claims

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Application Information

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IPC IPC(8): B29C65/48H05K3/00B32B37/00B32B37/06B32B37/10B32B37/12
CPCB29C65/48B29C66/80B29C66/45H05K3/0061B32B37/003B32B37/06B32B37/10B32B37/1207B32B2037/1223
Inventor 朱学进李鲲任焱杰
Owner TESA SE
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