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Foam grid composite heat-conducting fin as well as preparation method and application thereof

A technology of heat conduction sheet and grid sheet, which is applied in the field of foam grid composite heat conduction sheet and its preparation, can solve the problems of small thermal conductivity of heat conduction silicone grease, short circuit, limited improvement of heat transfer performance, etc., to reduce interface thermal resistance and heat conduction Good performance and anti-leakage effect

Pending Publication Date: 2021-02-26
湖南中材盛特新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the small thermal conductivity of thermal grease, the improvement of heat transfer performance is very limited.
[0003] When the working temperature of the existing alloy thermal conductive sheet electronic device is lower than the melting point of the alloy, due to the high hardness of the alloy, the pressing force between the electronic device and the radiator is insufficient, resulting in poor interface contact of the thermal conductive sheet and poor heat dissipation effect
When the working temperature is higher than the melting point of the alloy, the heat conduction sheet melts and its fluidity is particularly good. The pressing force between the electronic device and the radiator is easy to cause the liquid after the heat conduction sheet melts to squeeze out. If it flows to the circuit board, it is easy to cause short circuit phenomenon

Method used

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  • Foam grid composite heat-conducting fin as well as preparation method and application thereof
  • Foam grid composite heat-conducting fin as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] 1) The weight ratio of filling materials is 30 parts of bismuth, 50 parts of indium, 19 parts of tin and 1 part of zinc;

[0034] 2) Weigh metal bismuth, indium, tin and zinc according to the weight ratio of raw materials and put them into the crucible;

[0035] 3) After the crucible is put into the vacuum induction furnace, the vacuum is pumped to 0.5Pa, and the temperature rises to 250°C;

[0036] 4) After the bismuth, indium, tin, and zinc are melted, turn on the vacuum furnace and put the nickel foam mesh on the top of the crucible. The thickness of the nickel foam mesh is 0.2mm, the aperture is 0.02-0.1mm, and the porosity is 80%;

[0037] 5) After vacuuming to 0.5Pa, press the nickel foam mesh into the alloy liquid, and fill the vacuum furnace with nitrogen to 1MPa;

[0038] 6) After 5 minutes, take out the foamed nickel mesh impregnated with low melting point alloy to obtain the heat conduction sheet;

[0039] 7) After cooling, cut the heat conduction sheet to ...

Embodiment 2

[0043] 1) The weight ratio of filling materials is 33 parts of bismuth, 66 parts of indium and 1 part of tin;

[0044] 2) Weigh the metal bismuth, indium and tin into the crucible according to the weight ratio of the raw materials;

[0045] 3) Put the crucible into the vacuum induction furnace, evacuate to 0.5Pa, and raise the temperature to 300°C;

[0046] 4) After the bismuth, indium, tin, and zinc are melted, open the vacuum furnace and put the foamed copper mesh on the top of the crucible. The thickness of the foamed copper mesh is 0.3mm, the aperture is 0.02-0.1mm, and the porosity is 80%;

[0047] 5) After vacuuming to 0.5Pa, press the nickel foam mesh into the alloy liquid, and fill the vacuum furnace with nitrogen to 1MPa;

[0048] 6) After 5 minutes, take out the foamed copper mesh impregnated with low-melting point alloy to obtain a heat conduction sheet;

[0049] 7) After cooling, cut the heat conduction sheet to the required size.

[0050] The obtained thermal c...

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Abstract

The invention provides a foam grid composite heat-conducting fin. The composite heat-conducting fin comprises a foam grid and a low-melting-point alloy filled in the foam grid; and the low-melting-point alloy comprises the following components of, in parts by weight, 20-40 parts of bismuth, 40-70 parts of indium, 1-20 parts of tin and 0-2 parts of zinc. The foam grids are filled with metal, so that the thermal conductivity is good; when the working temperature is reached, the heat-conducting fin melts to fill a gap, and the interface thermal resistance is reduced; the foam grids can prevent the molten heat-conducting fin from leaking; and in addition, the foam grids can support pressing force between an electronic device and a radiator, and leakage is further prevented.

Description

technical field [0001] The invention belongs to the field of heat-conducting materials, and in particular relates to a foam grid composite heat-conducting sheet and a preparation method and application thereof. Background technique [0002] The surface of the electronic device and the heat sink is uneven. After being directly installed together, the actual contact area between the two is only about 10%-20% of the area of ​​the heat sink base, and the rest is the air gap. Since air conducts heat very poorly, the effectiveness of the heat sink is significantly reduced. Ordinary thermal conductive silicone grease can be filled in the gap between the electronic heating device and the heat sink to remove the air, reduce the contact thermal resistance, and improve the heat transfer performance. However, due to the small thermal conductivity of thermal conductive silicone grease, the improvement of heat transfer performance is very limited. [0003] When the working temperature o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C28/00C23C2/04C23C2/34H05K7/20
CPCC22C28/00C23C2/04C23C2/34H05K7/2039
Inventor 谭锴颜新奇
Owner 湖南中材盛特新材料科技有限公司