A multi-piece bonding structure of an LED semiconductor wafer

Abstract

The invention discloses a multi-piece bonding structure of LED semiconductor wafers, which includes upper and lower pressure heads, left and right positive and negative electrode stickers and semiconductor wafer carriers; The semiconductor wafers in the carrier are pressed together, and the upper and lower indenters are equipped with cooling systems and temperature sensors, which can cool the semiconductor wafers in the carrier and transmit the temperature of the indenters from time to time; the positive and negative stickers are both Contains a cooling system, a temperature sensor and an independent PID control system, which can individually adjust the current of each layer and control the temperature of each layer of carrier pressing blocks; each carrier has a built-in heating plate, and the carriers can be stacked It is multi-layered to realize synchronous bonding of multiple semiconductor chips; the heating plate of the carrier is in contact with the positive and negative electrodes. After the power is turned on, the heating plate of the carrier will generate heat to heat the semiconductor chips. The invention can realize multi-chip bonding, shorten bonding time and increase bonding productivity.

Description

technical field [0001] The invention relates to the technical field of multi-chip bonding structures, in particular to a multi-chip bonding structure of LED semiconductor wafers. Background technique [0002] The LED semiconductor bonding method is a process of heating and pressing LED semiconductor wafers. [0003] In the MEMS process, the most commonly used are silicon-silicon direct bonding and silicon-glass electrostatic bonding technology, followed by a variety of new bonding technologies, such as metal-metal bonding technology. However, although various technologies continue to As it turns out, every technology has its drawbacks. [0004] The CB8 chip bonding machine manufactured by SUSS MicroTec in Germany has promoted the development of MEMS technology to a certain extent. However, problems such as poor bonding or chip breakage often occur in the manufacturing process. It is found through research that the existing technology is to be Bonding is performed when the ...

AI Technical Summary

Problems solved by technology

At present, the bonding fixture can only realize the single-chip bonding structure, and in the bonding process, the heating method is used to heat up and down the pressure head. This method of heating up and down by heating and bonding takes a long time to cool down and cannot conduct heat directly. On the semiconductor wafer, if the bonding structure heated by the upper and lower indenters is changed to multi-chip bonding, the LED chip will be heated and cooled unevenly due to the difference in heat conduction and heat dissipation of the semiconductor wafer or the bonding fixture, which will eventually lead to bond failure. The combined LED chip has problems such as voids, serious warping and fragments

Images