Spraying method of wafer-level sensitive material and semiconductor sensor

Abstract

The invention relates to a spraying method of a wafer-level sensitive material and a semiconductor sensor. The spraying method of the wafer-level sensitive material comprises the following steps thata hole in a prepared mask plate is aligned with a sensitive area of a substrate; a precursor solution of the sensitive material to be coated is injected onto a spray head; spray head operation parameters are set; the spray head is aligned with the mask plate to start spraying; and after the spraying is finished, the mask plate is separated from the substrate to obtain the wafer-level sensitive material. According to the spraying method of the wafer-level sensitive material and the semiconductor sensor, by adopting a high-precision mask and combining a large-area spraying method, wafer level one-time uniform modification and fixation of a nanometer gas sensitive material can be realized; the spraying method is adopted, and the film forming thickness of the sensitive material can be accurately controlled by calculating the spraying time; by adopting a high-precision mask technology, a non-sensitive area can be perfectly protected from being polluted by the sensitive material so that a subsequent packaging process cannot be affected; and therefore by adopting the method, perfect compatibility with the subsequent process is achieved.

Description

technical field [0001] The invention belongs to the field of sensors, and in particular relates to a wafer-level sensitive material and a spraying method for semiconductor sensors. Background technique [0002] The micro metal oxide semiconductor sensor (MOS) based on nano-sensitive materials is a sensor with small size, low power consumption, high sensitivity, low price and good selectivity. This sensor, because of its low price and wide range of gas detection (the corresponding sensitive film can be selected according to the gas composition to realize multiple gas detection), is widely used in the monitoring of toxic gases in industrial parks, monitoring of industrial boilers and automobile exhaust emissions, furniture and It is widely used in fields such as monitoring of toxic and harmful gases released by building materials. [0003] However, the modification and fixation of the sensitive materials of the existing metal oxide detectors are not at the wafer level. The ba...

AI Technical Summary

Problems solved by technology

This method not only cannot solve the problem of mass production, resulting in high cost, but also the performance consistency of each sensor prepared by this method is poor

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