Surface treatment agent and method for p-type bismuth telluride-based material used in thermoelectric devices
A surface treatment agent and surface treatment technology, which is applied in the manufacture/treatment of thermoelectric devices, junction lead-out materials of thermoelectric devices, chemical instruments and methods, etc., can solve the problem of increasing production links and production costs, reducing yield and production efficiency , breakage of p-type bismuth telluride-based wafers, etc., to improve the yield and production efficiency, reduce the interface contact resistance and interface contact thermal resistance, and improve the interface bonding strength.
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Embodiment 1
[0035] A surface treatment method for p-type bismuth telluride-based material, which comprises the following steps:
[0036] 1) A semi-circular p-type bismuth telluride-based wafer with a diameter of 30 mm and a thickness of 0.3 mm was washed and degreasing with acetone to remove surface contaminants, dehydrated with absolute ethanol, and dried, and the surface roughness was tested with an OLS5000 laser scanning microscope. The degree Sa is 0.197 μm, and then immersed in the roughening solution (the composition of the roughening solution is 10% (volume) of hydrochloric acid, 40% (volume) of hydrogen peroxide, 5% (volume) of nitric acid, and the balance is water), and the roughening temperature is 30 ℃, roughening time 5min;
[0037] 2) Transfer the roughened p-type bismuth telluride-based wafer in step 1) into ash removal liquid (the composition of the ash removal liquid is hydrofluoric acid 50% (volume), hydrochloric acid 10% (volume), nitric acid 5% ( volume), and the remai...
Embodiment 2
[0059] A surface treatment method for p-type bismuth telluride-based material, which comprises the following steps:
[0060] 1) A semicircular p-type bismuth telluride-based wafer with a diameter of 30 mm and a thickness of 0.3 mm was washed and degreased with acetone to remove surface contaminants, dehydrated with anhydrous ethanol, dried, and then used for morphology observation by SEM, and then immersed in a coarsening solution (coarse The composition of the chemical solution is 20% (volume) of hydrochloric acid, 30% (volume) of hydrogen peroxide, 5% (volume) of nitric acid, and the remainder is water), the roughening temperature is 30°C, and the roughening time is 10min;
[0061] 2) The p-type bismuth telluride-based wafer after the roughening in step 1) is transferred into the ash removal liquid (the composition of the ash removal liquid is hydrofluoric acid 40% (volume), hydrochloric acid 10% (volume), nitric acid 5% ( The ash removal treatment was carried out in ash rem...
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