Solder mask device and solder mask method for package substrate

Abstract

The invention discloses a solder mask device and a solder mask method for a package substrate. The device comprises an automatic plate clamping machine, wherein the main body structure of the automatic plate clamping machine is 767mm in length, 825mm in height, and 640mm in width; an inserting frame is arranged at the top of the main body of the automatic plate clamping machine; an upper materialtaking bottom plate and a lower material taking bottom plate are arranged below the inserting frame, the size of the upper material taking bottom plate and the lower material taking bottom plate is 450mm*350mm, the upper material taking bottom plate and the lower material taking bottom plate are made of plastic, the upper material taking bottom plate and the lower material taking bottom plate aredesigned to be in a concave-convex shape, inserting frame positioning blocks are arranged at the four corners of the edges of the upper material taking bottom plate and the lower material taking bottom plate, and an inserting plate frame is arranged on the inserting frame positioning blocks. The automatic plate clamping machine is adopted to fix the process edge, so that the problem of plate bending of the baking plate is thoroughly solved. Especially in the ultra-thin package substrate industry, the warping degree can be improved from 1% to less than 0.5%, the yield of products is improved, the problem that plate edges are difficult to dry due to an original dense plate inserting frame is solved, and product defect scrapping caused by the non-drying problem in the production process is avoided due to the fact that the distance between the U-shaped inserting grooves is increased.

Description

technical field [0001] The invention relates to the technical field of packaging substrate processing, in particular to a solder protection device and a solder protection method for a packaging substrate. Background technique [0002] In the circuit board industry, the traditional solder mask screen printing ink is directly put into the board frame, and a board frame can be inserted into 10-30 pieces of silk-screened boards. The substrate inserted into the board frame is printed on one side and not printed on the other. The original method is to place the substrate to deliberately bend toward the printing ink direction to reduce the phenomenon of bending after single-sided ink printing. [0003] In the packaging substrate processing process, the screen printing, baking, flattening, and exposure of the solder mask process all need to be baked with a plug-in frame. The currently used plug-in frame uses U-shaped slot positioning on both sides of the fixed plate. If the U-shape...

AI Technical Summary

Problems solved by technology

[0003] In the packaging substrate processing process, the screen printing, baking, flattening, and exposure of the solder mask process all need to be baked with a plug-in frame. The currently used plug-in frame uses U-shaped slot positioning on both sides of the fixed plate. The lack of ventilation in the U-shaped slot will easily cause the edge of the plate to be difficult to dry. If the edge of the plate is not dried, it will easily cause product defects and scrap during the production process, and there is a problem of plate warpage.

[0004] The substrate in the common board rack in the market directly touches the U-shaped slot of the board rack, and there is a problem of ink sticking to the slot of the board rack or ink on the edge of the board.

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