Electronic component and method for manufacturing electronic component
A technology of electronic parts and manufacturing methods, which is applied in the direction of resistor manufacturing, capacitor manufacturing, and electrical component assembly of printed circuits, etc., can solve the problems of complicated positioning operations, difficult positioning, time-consuming, etc., and achieve simplified bonding operations, improved forming speed, The effect of reducing manufacturing costs
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0041] Hereinafter, a method of manufacturing the electronic component and the electronic component according to the present invention will be described with reference to the drawings.
[0042] [Sketching structure of electronic parts]
[0043] figure 1 It is a cross-sectional view showing the electronic component 1 of the present embodiment.
[0044] Such as figure 1 As shown, the electronic component 1 used as the thermistor or capacitor or the like is provided: the ceramic element 11; the glass Au layer 12a, 12b, formed on both sides of the ceramic element 11; pure Au layers 13a, 13b, formed in glass Au The layers 12a, 12b; and the Au-Sn alloy layer 14 are formed on the pure Au layer 13b.
[0045] The electronic component 1 is fixed to the bonding object such as the substrate (omitted). Specifically, by disparing the Au-Sn alloy layer 14 of the electronic component 1 to the joint surface of the engageable object, the melt-Sn alloy layer 14 is cooled, and the electronic compo...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap