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Low-nickel-zinc cupronickel shielding case and manufacturing method thereof

A manufacturing method and shielding cover technology, applied in local shielding, magnetic field/electric field shielding, electrical components, etc., can solve the problems of high temperature resistance and yellowing of low nickel white copper, improve solderability, reduce annealing temperature, and improve performance uniformity Effect

Active Publication Date: 2021-04-02
安徽鑫科铜业有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Another object of the present invention is to provide a low-nickel-zinc-nickel-nickel copper shield, which solves the problem of high-temperature yellowing of low-nickel-nickel-nickel copper, controls the softness temperature of the material through annealing, and effectively prevents the deformation of the material

Method used

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  • Low-nickel-zinc cupronickel shielding case and manufacturing method thereof
  • Low-nickel-zinc cupronickel shielding case and manufacturing method thereof

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Embodiment 1

[0070] A low-nickel-zinc-nickel-nickel shielding cover, comprising the following components in mass percentage:

[0071] Cu 59.35%, Ni 11.85%, Fe 0.15%, Pb 0.0025%, Mn: 0.20%, Sn 0.0010%, Zn balance.

[0072] The manufacturing method of the above-mentioned low-nickel-zinc-nickel-nickel shielding cover comprises the following steps:

[0073] 1) Ingredients: Recycled material, cupronickel corner material, zinc supplement block or bright copper wire, etc. are weighed and put into the melting furnace;

[0074] 2) Smelting: The weighed metals are mixed and melted into a melt, and the electrolytic manganese is added to the charcoal in the furnace, and the fine electrolytic manganese that is not completely melted on the charcoal is pounded into the copper liquid with a slag scoop.

[0075] In order to ensure the quality of the melt, the raw materials and covering agents used must be dry. After the preparation of the melt is completed, the composition is adjusted according to the re...

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Abstract

The invention provides a low-nickel-zinc cupronickel shielding case and a manufacturing method thereof. The low-nickel-zinc cupronickel shielding case comprises the following components: 58-60% of Cu,11-13% of Ni, less than or equal to 0.15% of Fe, less than or equal to 0.003% of Pb, 0.15-0.20% of Mn, less than or equal to 0.02% of Sn and the balance Zn. Compared with the prior art, the contentsof Cu and Ni of the low-nickel-zinc cupronickel shielding case are reduced, the balance Zn is increased, and the raw material cost can be reduced; a finished product cleaning process is added, the cleanliness of the surface of a material can be improved, and the solderability of the material is improved; and oil injection is carried out before finished product annealing, when surface grease is subjected to finished product annealing, oxide existing in fine grooves in the surface of a strip can be taken away at high temperature, the surface is cleaner after treatment, and the surface is not prone to yellowing when high-temperature baking is carried out. During finished product annealing, the temperature is 415 + / -5 DEG C, and the heat treatment time is 5-6 hours. Grains can be refined by reducing the bottoming annealing temperature, the material performance is homogenized, and the problem that four corners are punched unevenly due to uneven material performance is solved.

Description

technical field [0001] The invention belongs to the field of metal material preparation, and in particular relates to a low-nickel-zinc white copper shielding cover and a manufacturing method thereof. Background technique [0002] At present, the materials of shielding covers on the market generally use stainless steel and cupronickel. Stainless steel has good shielding effect, high strength, and moderate price, while cupronickel has slightly poorer shielding effect, is soft and easy to deform, but the weldability and thermal conductivity of cupronickel are better than stainless steel. high. Due to the stronger practicability of cupronickel, more zinc-nickel-nickel copper is chosen as the shielding cover material in terms of material selection. [0003] However, the existing C7521 and C7701 brand shields are relatively high in cost due to high nickel content, and there are currently many manufacturers. The production cost of this part of customers increases and the profit ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/04C22F1/08H05K9/00B23P15/00
CPCC22C9/04C22F1/08H05K9/002H05K9/0081B23P15/00
Inventor 冯丽婷李伟强
Owner 安徽鑫科铜业有限公司
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