Proximity sensor circuit and distance detection method

Abstract

The invention discloses a proximity sensor circuit and a distance detection method. The proximity sensor circuit comprises an LC oscillation circuit which is used for generating an oscillation signal with a specific frequency when a metal body is detected to be close to or far away from a coil; a sampling circuit which is used for collecting the oscillation signal generated by the LC oscillation circuit within a threshold voltage; a conversion circuit which is used for converting the oscillation signal acquired by the sampling circuit into a high-frequency pulse signal; a signal processing circuit which is used for carrying out operation processing on the high-frequency pulse signal generated by the conversion circuit and then executing different operations according to an instruction of a control circuit; the control circuit which is used for receiving a circuit external control instruction; and an input and output control circuit which is used for outputting the data sent by the control circuit through an output driving end OUT. Manual work is reduced in the aspect of machining, the yield is improved, the periphery of a product is simple, the size is small, the miniaturization requirement of customers is met, the consistency in performance is good, the precision is high, parameters can be set, the product upgrading requirement is met, and extremely high practicability is achieved.

Description

technical field [0001] The invention belongs to the technical field of proximity sensors, and in particular relates to a proximity sensor circuit and a distance detection method. Background technique [0002] LC proximity sensors are widely used in industrial equipment, automotive electronics and other fields. At present, most of these proximity sensors on the market use discrete devices or analog circuits such as general-purpose amplifiers and comparators to realize distance recognition, distance setting and other parameters. The setting is done by adjusting external devices such as external resistors or capacitors. [0003] At present, the traditional production process of proximity sensors is as follows: circuit board patch processing - welding discrete devices - circuit board debugging - assembly - glue filling - aging test; Influenced by factors such as the external environment, the consistency of the product is poor, and the detection accuracy is not high. After the c...

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Problems solved by technology

[0003] At present, the traditional production process of proximity sensors is as follows: circuit board patch processing - welding discrete devices - circuit board debugging - assembly - glue filling - aging test; Influenced by factors such as the external environment, the consistency of the product is poor, and the detection accuracy is not high. After the circuit board is debugged, it needs to be filled with glue and assembled. Adjustment, resulting in the loss of finished product yield; and because each product needs to be debugged before assembly, it requires a lot of labor, low efficiency and slow speed. With the increase of labor costs in recent years and the improvement of end customers' performance requirements for products, There are still a large number of products that need to be miniaturized, and traditional LC proximity sensors are increasingly unable to meet the needs of terminals

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