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Heat-conducting photoresist and application thereof

A technology of photoresist and thermally conductive filler, which is applied in the direction of photosensitive materials used in optomechanical equipment, etc., and can solve the problems of inability to transfer heat, thermally conductive packaging glue, and non-thermal conduction.

Pending Publication Date: 2021-04-09
FUZHOU UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, commercial display devices generally use heat-conducting encapsulants in the packaging part to assist the heat dissipation of the device, but most of the LED device structures are organic polymers that do not conduct heat, which cannot effectively transfer heat to the outside heat-conducting encapsulant

Method used

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  • Heat-conducting photoresist and application thereof
  • Heat-conducting photoresist and application thereof

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Embodiment Construction

[0020] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0021] The invention provides a heat-conducting photoresist, which is formed by adding sub-micron-level heat-conducting fillers to the common UV-sensitive resin photoresist. The thermally conductive filler does not need to be pretreated, and can be directly mixed with the resin photoresist according to a set mass ratio and vigorously stirred and evenly dispersed. The thermally conductive filler has no effect on the physical and chemical properties of the photoresist.

[0022] The resin photoresist is at least one of polyvinyl laurate photoresist, ethylenic monomer photoresist and azidoquinone compound photoresist.

[0023] The thermally conductive filler is at least one of metal, metal oxide, carbon material, nitride, carbide, and silicon material. Preferably, the metal is metal powder, at least one of silver, copper or tin, preferab...

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Abstract

The invention relates to a heat-conducting photoresist which is prepared by adding a submicron heat-conducting filler into a resin photoresist sensitive to ultraviolet light. The heat-conducting filler does not need to be pretreated, and can be directly and uniformly mixed and dispersed with resin photoresist according to a set mass ratio. The heat-conducting photoresist is applied between LED pixel points on a display device. The heat-conducting photoresist is beneficial to improving the heat dissipation effect of the display device, thereby improving the performance and prolonging the service life of the display device.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to a heat-conducting photoresist and its application. Background technique [0002] Photoresist is a commonly used material for patterning pixel pits in the display field. However, the poor thermal conductivity of the photoresist itself makes the LED device generate considerable heat in a small local area during operation. As these LED operating temperatures rise, the expected performance and lifetime of the LEDs degrade due to high temperature effects. [0003] At present, commercial display devices generally use heat-conducting encapsulant in the packaging part to assist the heat dissipation of the device, but most of the LED device structures are organic polymers that do not conduct heat, and cannot effectively transfer heat to the external heat-conducting encapsulant. Contents of the invention [0004] The object of the present invention is to provide a heat-con...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004
CPCG03F7/004
Inventor 李福山郑春波胡海龙冯晨郑鑫郭太良
Owner FUZHOU UNIV
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