Heat-conducting photoresist and application thereof

A technology of photoresist and thermally conductive filler, which is applied in the direction of photosensitive materials used in optomechanical equipment, etc., and can solve the problems of inability to transfer heat, thermally conductive packaging glue, and non-thermal conduction.

Pending Publication Date: 2021-04-09
FUZHOU UNIV +1
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, commercial display devices generally use heat-conducting encapsulants in the packaging part to assist the heat dissipation of the device, but most of the LED device structures are organic polymers that do not conduct heat, which cannot effectively transfer heat to the outside heat-conducting encapsulant

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat-conducting photoresist and application thereof
  • Heat-conducting photoresist and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0021] The invention provides a heat-conducting photoresist, which is formed by adding sub-micron-level heat-conducting fillers to the common UV-sensitive resin photoresist. The thermally conductive filler does not need to be pretreated, and can be directly mixed with the resin photoresist according to a set mass ratio and vigorously stirred and evenly dispersed. The thermally conductive filler has no effect on the physical and chemical properties of the photoresist.

[0022] The resin photoresist is at least one of polyvinyl laurate photoresist, ethylenic monomer photoresist and azidoquinone compound photoresist.

[0023] The thermally conductive filler is at least one of metal, metal oxide, carbon material, nitride, carbide, and silicon material. Preferably, the metal is metal powder, at least one of silver, copper or tin, preferab...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to view more

Abstract

The invention relates to a heat-conducting photoresist which is prepared by adding a submicron heat-conducting filler into a resin photoresist sensitive to ultraviolet light. The heat-conducting filler does not need to be pretreated, and can be directly and uniformly mixed and dispersed with resin photoresist according to a set mass ratio. The heat-conducting photoresist is applied between LED pixel points on a display device. The heat-conducting photoresist is beneficial to improving the heat dissipation effect of the display device, thereby improving the performance and prolonging the service life of the display device.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to a heat-conducting photoresist and its application. Background technique [0002] Photoresist is a commonly used material for patterning pixel pits in the display field. However, the poor thermal conductivity of the photoresist itself makes the LED device generate considerable heat in a small local area during operation. As these LED operating temperatures rise, the expected performance and lifetime of the LEDs degrade due to high temperature effects. [0003] At present, commercial display devices generally use heat-conducting encapsulant in the packaging part to assist the heat dissipation of the device, but most of the LED device structures are organic polymers that do not conduct heat, and cannot effectively transfer heat to the external heat-conducting encapsulant. Contents of the invention [0004] The object of the present invention is to provide a heat-con...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004
CPCG03F7/004
Inventor 李福山郑春波胡海龙冯晨郑鑫郭太良
Owner FUZHOU UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap