Three-dimensional integrated structure and manufacturing method thereof
A technology of three-dimensional integration and connecting holes, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of increasing capacitance density and unresolved capacitance, so as to improve overall performance, reduce surface area, and increase nanocapacitance effect of density
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[0065]In order to make the objects, technical solutions, and advantages of the present invention, the technical solutions in the embodiments of the present invention will be described in connection with the drawings of the present invention, and will be described in connection with the drawings of the present invention. Embodiments, not all of the embodiments. Based on the embodiments of the present invention, those of ordinary skill in the art will belong to the scope of the present invention without all other embodiments obtained without creative labor. Unless otherwise defined, the technical terms used herein or scientific terms should be understood by those who have general skills in the art of the present invention. Similar words to "including" as used herein refers to the elements or objects of the previous article or objects that exhibit appear later in the word and their equivalents without excluding other elements or objects.
[0066]For the problems present in the prior art, ...
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