Preparation method of liquid metal film
A liquid metal, thin film technology, applied in metal material coating process, vacuum evaporation plating, coating and other directions, can solve the problems of complex process, inconvenient operation, difficult to accurately control the amount of electrostatic charge applied, etc., to improve the uniform dispersion Sex, reduce the effect of agglomeration
Inactive Publication Date: 2021-04-16
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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Problems solved by technology
However, due to the high surface tension of the liquid metal itself, the liquid metal particles are often in a rolling state on the substrate surface. During the deposition process, the liquid metal particles are often agglomerated on the substrate, and it is difficult to spread evenly on the entire substrate surface to form a continuous conductive layer. film
For this reason, this patent document proposes a method of applying an electrostatic charge on the surface of a flexible substrate to reduce the surface tension of liquid metal, but the process of this method is relatively complicated, it is difficult to accurately control the amount of applied electrostatic charge, and it is not easy to operate in the experiment
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Embodiment 2
[0045] This example is a comparative example of Example 1 above.
[0046] In this embodiment, the substrate material and liquid metal are exactly the same as those in Embodiment 1.
[0047] In this embodiment, the liquid metal thin film is deposited on the substrate surface, the deposition method is basically the same as that of Embodiment 1, and the specific process is as follows:
[0048] like figure 1 As shown, the evaporation boat 1 and the flexible substrate 2 are placed in the airtight cavity, and 0.3ml of liquid metal is extracted and placed in the evaporation boat 1 as the evaporation material, and the following operations are performed:
[0049] (1) Turn on the mechanical pump to evacuate the chamber until the vacuum degree reaches 10 -4 At Pa, electric heating evaporation boat 1, the heating parameters are set as follows: voltage 2V, current changes from 180A to 200A, keep the voltage display constant, the liquid metal evaporates when heated, deposits liquid metal ...
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Abstract
The invention discloses a preparation method of a liquid metal film. According to the method, a thermal evaporation technology is adopted, liquid metal serves as an evaporation source to be evaporated and deposited on the surface of a substrate to form the liquid metal film, the evaporation and deposition process is divided to be carried out multiple times in the process, and gas is introduced between every two adjacent times, so that the surfaces of deposited liquid metal particles are oxidized, and agglomeration of the liquid metal particles in the deposition process is reduced; the dispersion uniformity of the liquid metal particles on the surface of the substrate is improved, and the whole film formed through multiple times of deposition has electrical conductivity; and in addition, the thickness of the liquid metal film can be controlled by setting evaporation parameters and / or regulating and controlling the deposition times, and the liquid metal film with the resistance from ohm to megohm is obtained.
Description
technical field [0001] The invention relates to the technical field of flexible electronics, in particular to a method for preparing a liquid metal thin film. Background technique [0002] With the improvement of people's living standards, the demand for flexible wearable devices is gradually increasing. As a part of various flexible device units, flexible conductive films are of great significance to the realization of wearable devices. In addition, the research on electronic skin is in the ascendant, and the research on flexible circuits is of great significance to its development. [0003] The existing flexible circuit preparation methods mainly use conductive polymer materials, hydrogels, nanomaterials and liquid metals. Among them, liquid metal materials are favored due to their fluid flexibility, high electrical conductivity, and non-toxicity. In addition, with the development of miniaturization of electronic equipment, ultra-thin electronic skin and integrated mini...
Claims
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IPC IPC(8): C23C14/26C23C14/20C23C14/54
CPCC23C14/26C23C14/20C23C14/54
Inventor 刘宜伟韩欣彤李法利李润伟
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI