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Prepreg spliced by regional glass fiber cloth, PCB and splicing method

A technology of prepreg and glass fiber cloth, which is applied in the direction of printed circuit components and conductive pattern formation, etc., can solve the problem of high production cost of prepreg, achieve the effect of taking into account integrity and reducing production cost

Pending Publication Date: 2021-04-23
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems existing in the prior art, the present invention innovatively proposes a prepreg, PCB board, and splicing method for splicing glass fiber cloth in different regions, which effectively solves the problem of high production cost of the prepreg caused by the prior art, and effectively reduces the cost of the prepreg. Production cost, while taking into account the integrity of the signal, to ensure the quality of the product

Method used

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  • Prepreg spliced by regional glass fiber cloth, PCB and splicing method
  • Prepreg spliced by regional glass fiber cloth, PCB and splicing method
  • Prepreg spliced by regional glass fiber cloth, PCB and splicing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Such as figure 2 As shown, the present invention provides a prepreg spliced ​​with glass fiber cloth in different regions, which is located between the first wiring layer L1 and the second wiring layer L2 adjacent to the first wiring layer L1, including: the first glass Fiber cloth 1 and second glass fiber cloth 2, the first glass fiber cloth 1 is located in the area where high-speed signal lines pass through the prepreg (PP), and the second glass fiber cloth 2 is located in the area where low-speed signal lines pass through the prepreg, where the high-speed signal The line is a high-speed signal routing path that communicates with the second wiring layer L2 through a via hole in the first wiring layer L1, and the low-speed signal line is a communication path between the first wiring layer L1 and the second wiring layer L2 through a via hole. For the connected low-speed signal routing path, the cost of the first glass fiber cloth 1 is greater than that of the second gl...

Embodiment 2

[0035] The technical solution of the present invention also provides a PCB board, including several prepregs spliced ​​with sub-regional glass fiber cloths according to Embodiment 1.

[0036] The prepregs between adjacent wiring layers that are communicatively connected to each other are prepregs spliced ​​with glass fiber cloth in different areas.

[0037] In particular, if the communication connection between the first wiring layer and the second wiring layer, and the first wiring layer and the second wiring layer span multiple wiring layers, the high-speed signal lines of the first wiring layer By communicating and connecting the multiple prepregs with the second wiring layer, the multiple prepregs are all preferably selected from the first glass fiber cloth.

[0038] The prepreg between the adjacent wiring layers in the technical solution of the present invention is the prepreg spliced ​​by the glass fiber cloth in the sub-regions, which effectively reduces the production ...

Embodiment 3

[0040] Such as image 3 As shown, the technical solution of the present invention also provides a method for splicing prepregs with glass fiber cloth in sub-regions, which is located between the first wiring layer and the second wiring layer adjacent to the first wiring layer, including:

[0041] S1, the first wiring layer is divided into high-speed signal lines and low-speed signal lines according to the signal rise time;

[0042]S2, in the prepreg layer, the first glass fiber cloth is set in the area where the high-speed signal line passes, and the second glass fiber cloth is set in the area where the low-speed signal line passes. The high-speed signal wiring path for communication connection of the wiring layer, the low-speed signal wiring path is the low-speed signal wiring path for communication connection with the second wiring layer through via holes in the first wiring layer, and the cost of the first glass fiber cloth is greater than that of the second glass fiber clo...

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Abstract

The invention provides a prepreg spliced by regional glass fiber cloth. The prepreg is located between a first wiring layer and a second wiring layer adjacent to the first wiring layer and comprises first glass fiber cloth and second glass fiber cloth; the first glass fiber cloth is located in the area, where a high-speed signal line passes through, in the prepreg; the second glass fiber cloth is located in an area, where a low-speed signal line passes through, in the prepreg; the high-speed signal line is a high-speed signal wiring path which is in communication connection with the second wiring layer through a via hole in the first wiring layer; the low-speed signal line is a low-speed signal wiring path which is in communication connection with the second wiring layer through a via hole in the first wiring layer; the cost of the first glass fiber cloth is greater than the cost of the secondglass fiber cloth. The invention further provides a PCB and a prepreg splicing method. The problem that the production cost of prepregs is high in the prior art is effectively solved, the production cost of the prepreg is effectively reduced, meanwhile, the integrity of signals is considered, and the quality of products is guaranteed.

Description

technical field [0001] The invention relates to the field of prepreg design, in particular to a prepreg, a PCB board and a splicing method spliced ​​with glass fiber cloth in different regions. Background technique [0002] Prepreg (PP) is a sheet material made of glass fiber cloth (glass fiber cloth), impregnated with epoxy resin glue, and then heat-treated (dried). [0003] Such as figure 1 As shown, glass fiber cloth is divided into Standard, Expanded and Spread. The choice of glass fiber cloth and the corresponding glass fiber effect have a great influence on the integrity of high-speed signals. Generally, high-speed PCB boards use glass fiber cloth with low dielectric constant, such as flat cloth (glass fiber cloth that has been flattened). [0004] In the prior art, even if a certain wiring layer has different rate distributions (parts are high-speed wiring, other parts are low-speed wiring), in order to ensure the integrity of the signal and reduce the influence of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/10
Inventor 孙广元荣世立
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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