Semiconductor package and manufacturing method thereof

Abstract

Embodiments of the present disclosure relate to a semiconductor package. The semiconductor package includes a substrate, a conductive pillar, and a metal layer. The substrate has a first surface, a second surface opposite to the first surface, and an opening extending from the first surface to the second surface. The opening is provided with a side wall, and the conduction column is arranged in the opening. The metal layer is arranged in the substrate. The metal layer and the conductive pillar are substantially located at the same horizontal height. Another embodiment of the present disclosure relates to a manufacturing method of the semiconductor package.

Description

technical field [0001] The present invention relates to a semiconductor package and a manufacturing method thereof, and more particularly, to a semiconductor package having a metal layer and an insulating layer encapsulating the metal layer. Background technique [0002] As the demand for high line density per unit volume increases, reducing the line width / space (L / S) is a method for increasing the line density per unit volume. However, when the line width is reduced, it may be due to the unavoidable drum-side effect during soldering, which may lead to solder bridges and cause short circuits. 20 μm) structures are often overlooked. Contents of the invention [0003] Embodiments of the disclosure relate to a semiconductor package. The semiconductor package includes a substrate, a conductive pillar, and a metal layer. The substrate has a first surface, a second surface opposite to the first surface, and an opening extending from the first surface to the second surface. T...

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Problems solved by technology

However, when the line width is reduced, it may be due to the unavoidable drum-side effect during soldering, which may lead to solder bridges and cause short circuits. 20 µm) are often overlooked in structures

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