Busbar terminal and IGBT power module

Abstract

The invention provides a busbar terminal which is applied to a high-power IGBT module. The busbar terminal comprises an emitter busbar and a collector busbar, wherein each of the emitter busbar and the collector busbar comprises a main body part and a pin arranged at the bottom of the main body part; and each pin comprises a pin ankle part connected with the main body part and a tail end part connected with the pin ankle part, and the pin ankle part and the tail end part are located on different planes. The busbar terminal provided by the invention can be better connected with a lining plate. According to the busbar terminal, mechanical stress generated in an ultrasonic welding process and thermoelectric coupling stress under a follow-up large-current working condition can be released, and electromagnetic torque of Lorentz force at an end can be reduced.

Description

technical field [0001] The present invention relates to the technical field of power semiconductor devices, and more specifically, to a busbar terminal and an IGBT power module. Background technique [0002] Fully-controlled power semiconductor modules represented by IGBTs are widely used in high-power electric energy conversion occasions such as new energy power generation, smart grid, direct current transmission and electric locomotives. As the capacity demand of power electronic power conversion equipment continues to increase, the current capacity demand of the high-voltage and high-power IGBT module, which is its core component, is also increasing. Under the same standard package size constraints, the increase in current capacity will cause reliability problems such as high thermoelectric coupling stress and strong high electromagnetic torque on the busbar terminals of the power module. [0003] There are two main interconnection modes of the busbar terminals inside th...

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Problems solved by technology

However, in the process of ultrasonic welding, the high-frequency vibration wave energy of the ultrasonic welding process will pass through the terminals to be welded and be transmitted to other non-welded parts of the busbar, resulting in metal fatigue and uneven residual stress at the non-welded parts. other reliability issues

[0006] During the dynamic switching process of the IGBT power module, the high-current on-off work will generate high electromagnetic stress on the busbar, and the traditional welding process and the busbar terminal with a planar structure cannot cope with the high-current conditions. Reliability problems caused by strong thermoelectric stress and high electromagnetic torque

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