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Busbar terminal and IGBT power module

A busbar terminal and busbar technology, applied in the field of power semiconductor devices, can solve the problems of metal fatigue in non-welded parts, inability to cope with the reliability problems of strong thermoelectric stress and high electromagnetic torque, uneven residual stress, etc., to enhance the electromagnetic torque resistance. The effect of stress

Active Publication Date: 2021-05-04
ZHUZHOU CSR TIMES ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of ultrasonic welding, the high-frequency vibration wave energy of the ultrasonic welding process will pass through the terminals to be welded and be transmitted to other non-welded parts of the busbar, resulting in metal fatigue and uneven residual stress at the non-welded parts. other reliability issues
[0006] During the dynamic switching process of the IGBT power module, the high-current on-off work will generate high electromagnetic stress on the busbar, and the traditional welding process and the busbar terminal with a planar structure cannot cope with the high-current conditions. Reliability problems caused by strong thermoelectric stress and high electromagnetic torque

Method used

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  • Busbar terminal and IGBT power module
  • Busbar terminal and IGBT power module
  • Busbar terminal and IGBT power module

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Embodiment Construction

[0032] The present invention will be further described below in conjunction with accompanying drawing.

[0033] like figure 1 As shown, a busbar terminal 10 according to the present application is shown. like figure 1 As shown, the busbar terminal 10 includes an emitter busbar 1 and a collector busbar 2. Both the emitter busbar 1 and the collector busbar 2 include a main body part 11, 21 and a Pins 12,22. Wherein, the pin 12,22 includes the tube ankle portion 121,221 connected with the main body portion 11,21, and the end portion 122,222 connected with the tube ankle portion 121,221, the tube ankle portion 121,221 and the end portion 122,222 are located in different planes, that is, the tube ankle portion There is an angle between 121, 221 and tip 122, 222 which is not 180 degrees. Preferably, the tube ankle portion 121, 221 and end portion 122, 222 are at 90 degrees.

[0034] exist figure 1 In the illustrated embodiment, the longitudinal section of the tube ankle portio...

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PUM

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Abstract

The invention provides a busbar terminal which is applied to a high-power IGBT module. The busbar terminal comprises an emitter busbar and a collector busbar, wherein each of the emitter busbar and the collector busbar comprises a main body part and a pin arranged at the bottom of the main body part; and each pin comprises a pin ankle part connected with the main body part and a tail end part connected with the pin ankle part, and the pin ankle part and the tail end part are located on different planes. The busbar terminal provided by the invention can be better connected with a lining plate. According to the busbar terminal, mechanical stress generated in an ultrasonic welding process and thermoelectric coupling stress under a follow-up large-current working condition can be released, and electromagnetic torque of Lorentz force at an end can be reduced.

Description

technical field [0001] The present invention relates to the technical field of power semiconductor devices, and more specifically, to a busbar terminal and an IGBT power module. Background technique [0002] Fully-controlled power semiconductor modules represented by IGBTs are widely used in high-power electric energy conversion occasions such as new energy power generation, smart grid, direct current transmission and electric locomotives. As the capacity demand of power electronic power conversion equipment continues to increase, the current capacity demand of the high-voltage and high-power IGBT module, which is its core component, is also increasing. Under the same standard package size constraints, the increase in current capacity will cause reliability problems such as high thermoelectric coupling stress and strong high electromagnetic torque on the busbar terminals of the power module. [0003] There are two main interconnection modes of the busbar terminals inside th...

Claims

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Application Information

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IPC IPC(8): H01L23/498H01L29/739
CPCH01L23/49838H01L29/7393H01L2224/49111H01L2224/48227
Inventor 李道会刘国友罗皓泽李想王彦刚罗海辉
Owner ZHUZHOU CSR TIMES ELECTRIC CO LTD
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