Filtering unit and filtering chip applied to color imaging

A filtering unit and color filtering technology, applied to color TV components, color TV, electrical components, etc., can solve the problems of low color discrimination, low color restoration quality, and poor cut-off performance

Pending Publication Date: 2021-05-07
XIAN RUIXIN MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of this device are: poor cut-off performance, low color

Method used

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  • Filtering unit and filtering chip applied to color imaging
  • Filtering unit and filtering chip applied to color imaging
  • Filtering unit and filtering chip applied to color imaging

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0035] Such as figure 1 As shown, 301 is a dye thin film layer, 201 is a multilayer interference filter structure, and the dye thin film layer is located above the multilayer interference filter structure. An optional preparation method for the dye film layer is to form a filter film by combining dyes and polymer resins. The dye film layer filters through the selective absorption characteristics of the dye. People can prepare dye film layers that absorb different wavelengths by adjusting the dye molecules in the dye film layer. Common dye molecules in the prior art include: red light absorbing dye molecules, Absorb blue light dye molecules, absorb green light dye molecules, red, green, and blue are the three primary colors of light, and can synthesize light of any color, so the frequency of use is relatively high.

[0036] The transmittance is the light transmittance of light in the light transmission range, and the cut-off rate is the light transmittance of light in the cut-...

Embodiment 1

[0047] This embodiment selects (A / B) n Two kinds of dielectric film layers with high and low refractive index are deposited alternately by means of a multi-layer film interference filter structure to prepare a wide-spectrum color filter chip.

[0048] Such as figure 1 As shown, the preparation method of the wide-spectrum color filter chip provided by the present invention at least includes the following steps:

[0049] 1) On the surface of the CMOS image sensor 101, make a mask layer by photolithography, deposit the color RGB filter multilayer film structure layer corresponding to the filter pixel, and combine the lift-off stripping process to complete the fabrication of one of the RGB pixel filter structure layers; repeat In the above steps, the multi-layer film structure corresponding to the RGB filter pixel is deposited one by one, and the RGB pixel structure array production 201 of all filter channels is completed;

[0050] 2) coating the dye film layer 301 corresponding...

Embodiment 2

[0055] This embodiment selects (A / B) n Two kinds of thin film materials, metal and dielectric, are alternately deposited by means of a multi-layer film interference filter structure to prepare a wide-spectrum color filter chip.

[0056] Such as figure 1 As shown, the preparation method of the wide-spectrum color filter chip provided by the present invention at least includes the following steps:

[0057] 1) On the surface of the CMOS image sensor 101, make a mask layer by photolithography, deposit the color RGB filter multilayer film structure layer corresponding to the filter pixel, and combine the lift-off stripping process to complete the fabrication of one of the RGB pixel filter structure layers; repeat In the above steps, the multi-layer film structure corresponding to the RGB filter pixel is deposited one by one, and the RGB pixel structure array production 201 of all filter channels is completed;

[0058] 2) coating the dye thin film layer 301 corresponding to the re...

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Abstract

The invention discloses a filtering unit applied to color imaging, which is characterized in that a dye film layer is arranged on the upper surface of a multilayer film interference filtering structure, and the dye film layer doubly absorbs incident and reflected non-transmission light rays. In addition, the invention further discloses a wide-spectrum color filter chip integrated with the filter unit and a preparation method of the wide-spectrum color filter chip, the filter chip solves the contradiction between high transmittance and low cut-off transmittance of a traditional dye filter film, and application of a multilayer film interference filter structure to the field of color imaging and display becomes reality.

Description

technical field [0001] The invention relates to the field of color imaging and display, in particular to a filter unit and a filter chip applied to color imaging. Background technique [0002] At present, the camera performance requirements for mobile applications such as smartphones are getting higher and higher. The color reproduction ability of color cameras is directly related to image quality, and is a key indicator that major camera manufacturers value. Today's mainstream color imaging technology uses black and white image sensors combined with RGB color filter arrays (CFA) to achieve color synthesis and color reproduction. The most commonly used CFA structure is usually a filter film composed of dyes and polymer resins. Selective absorption characteristics for filtering. However, when maintaining sufficient transmittance, the traditional dye-based color filter structure has poor cut-off performance in the non-transmissive region, and the discrimination of different w...

Claims

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Application Information

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IPC IPC(8): G02B5/28G02B5/22H04N9/04
CPCG02B5/286G02B5/223H04N25/134
Inventor 郑宏志
Owner XIAN RUIXIN MICROELECTRONICS CO LTD
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