Preparation method of high-reflection anti-laser film layer on surface of silicon nitride ceramic substrate
A silicon nitride ceramic, substrate surface technology, applied in the direction of final product manufacturing, sustainable manufacturing/processing, climate sustainability, etc., can solve the problems of structural damage, large heat, high laser absorption rate
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
specific Embodiment approach 1
[0021] Specific embodiment one: present embodiment a kind of preparation method of silicon nitride ceramic substrate surface high reflection anti-laser film layer, it is finished according to the following steps:
[0022] 1. Surface pretreatment of silicon nitride ceramics:
[0023] Cleaning and drying the silicon nitride ceramics to obtain pretreated silicon nitride ceramics;
[0024] 2. Preparation of titanium oxide nano-slurry:
[0025] Mix nano-titanium dioxide, acrylic resin and acetone, and stir magnetically for 1h-2h under the condition of rotating speed of 500r / min-1000r / min to obtain the slurry. Under the condition of power of 500W-1000W, the slurry is ultrasonically Oscillate for 1h to 2h, then place the oscillated slurry in a cell disruptor, and under the condition of the probe power of 1000W to 1200W, ultrasonically oscillate the probe for 3min to 5min to obtain titanium oxide nano-slurry;
[0026] The mass ratio of the nano-titanium dioxide to the acrylic resin ...
specific Embodiment approach 2
[0033] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the cleaning described in step 1 is performed under the condition of ultrasonic power of 500W-1000W, placed in acetone for ultrasonic cleaning for 1h-2h, and then Under the condition of 500W-1000W, place it in alcohol for ultrasonic cleaning for 1h-2h, and finally, under the condition of ultrasonic power of 500W-1000W, place it in deionized water for ultrasonic cleaning for 1h-2h. Others are the same as in the first embodiment.
specific Embodiment approach 3
[0034] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the drying described in step 1 is vacuum drying in a vacuum oven for 2 hours at a temperature of 60° C. to 100° C. Others are the same as in the first or second embodiment.
PUM
| Property | Measurement | Unit |
|---|---|---|
| Thickness | aaaaa | aaaaa |
| Particle size | aaaaa | aaaaa |
| Particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


