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Transfer printing process method for filling via hole with silver colloid

A process method and via hole technology, which is applied in the field of silver glue filling in the transfer printing process, can solve the problems of low conduction performance of the first-level appearance, influence of conduction performance, and unfavorable use, so as to improve innovation and conduction performance , the effect of reducing labor costs

Pending Publication Date: 2021-05-18
KUNSHAN LIANTAO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current existing technology has the risk of buried copper pillar connection and structural limitations, which is not conducive to actual use. At the same time, there is also a single-sided conduction structure limitation of blind holes, which affects the conduction performance, and there is also a poor conduction performance in the first-level appearance. Low issues, needs to be improved

Method used

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  • Transfer printing process method for filling via hole with silver colloid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Embodiment one, refer to figure 1 , the transfer printing process method for filling via holes with silver glue comprises the following steps:

[0021] S1, first fill the via hole silver paste into the via hole;

[0022] S2, subsequently transferring the inner pattern;

[0023] S3, and then transfer the front pattern.

[0024] Preferably, in S1, the viscosity of the via-hole silver paste is 2500cp, and the via-hole silver paste is added with an amine curing agent or a cyanotype curing agent.

[0025] Preferably, in S2, the through-hole silver paste is filled into the via holes by an automatic glue dispenser, and the needle of the automatic glue dispenser is a dispensing needle with an inner diameter of 0.21 mm.

[0026] Preferably, in S2, the air pressure of the automatic glue dispenser is 0.35Mpa, and one glue-out operation and two press-down operations are adopted.

[0027] Preferably, after the dispensing of the automatic glue dispenser is completed, the product ...

Embodiment 2

[0029] Embodiment two, refer to figure 1 , the transfer printing process method for filling via holes with silver glue comprises the following steps:

[0030] S1, first fill the via hole silver paste into the via hole;

[0031] S2, subsequently transferring the inner pattern;

[0032] S3, and then transfer the front pattern.

[0033] Preferably, in S1, the viscosity of the via hole silver paste is 2550cp, and the via hole silver paste is added with an amine curing agent or a cyanotype curing agent.

[0034] Preferably, in S2, the via-hole silver paste is filled into the via holes by an automatic glue dispenser, and the needle of the automatic glue dispenser is a dispensing needle with an inner diameter of 0.36 mm.

[0035] Preferably, in S2, the air pressure of the automatic glue dispenser is 0.40Mpa, and one glue-out operation and two press-down operations are adopted.

[0036] Preferably, after the dispensing of the automatic glue dispenser is completed, the product is l...

Embodiment 3

[0038] Embodiment three, refer to figure 1 , the transfer printing process method for filling via holes with silver glue comprises the following steps:

[0039] S1, first fill the via hole silver paste into the via hole;

[0040] S2, subsequently transferring the inner pattern;

[0041] S3, and then transfer the front pattern.

[0042] Preferably, in S1, the viscosity of the via-hole silver paste is 2600cp, and the via-hole silver paste is added with an amine curing agent or a cyanotype curing agent.

[0043] Preferably, in S2, the through-hole silver paste is filled into the via holes by an automatic glue dispenser, and the needle of the automatic glue dispenser is a glue dispense needle with an inner diameter of 0.35 mm.

[0044] Preferably, in S2, the air pressure of the automatic glue dispenser is 0.42Mpa, and one glue-out operation and two press-down operations are adopted.

[0045] Preferably, after the dispensing of the automatic glue dispenser is completed, the pro...

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Abstract

The invention provides a transfer printing process method for filling a via hole with silver colloid, and relates to the technical field of silver colloid filling in a transfer printing process, and the transfer printing process method for filling the via hole with the silver colloid comprises the following steps: S1, filling a via hole with via hole silver paste; S2, then transferring an inner side pattern; and S3, transferring a front face pattern. Compared with the prior art, the method has the advantages that the problem of conduction of circuits on the front side and the back side of a product can be solved through a mold and LASER through holes; meanwhile, the problem of conduction of a circuit on the first-level appearance surface and the inner side is solved, actual use is facilitated, the operation process is simple and convenient, and the cost of embedding copper nails is reduced. The copper nail and the conductive ink are connected while the cost is reduced, the innovativeness is further improved, the problem of bubbles in the filled hole is solved by dispensing the conductive silver adhesive and the conductive silver oil, the conduction performance is improved, and due to the application of the automatic dispensing machine, the labor cost can be reduced, and the method is relatively economical.

Description

technical field [0001] The invention relates to the technical field of silver glue filling in a transfer printing process, in particular to a transfer printing process method for filling via holes with silver glue. Background technique [0002] With the continuous development of semiconductor technology, the current memory manufacturing technology has gradually transitioned from a simple planar structure to a more complex three-dimensional structure. The technology research and development of three-dimensional memory is one of the mainstreams of international research and development. In the layout of semiconductors, active regions, The connections between polysilicon and metal layers need to be realized through contact holes or via holes. The connection between the active area, the polysilicon and the metal layer is called a contact hole. Connections between different metal layers are called vias. [0003] The current existing technology has the risk of buried copper pill...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/768B05C5/02B05C11/10B05D1/26B05D3/02B41M1/26
CPCB05C5/02B05C11/10B05D1/26B05D3/0254B41M1/26H01L21/76895
Inventor 张云青李磊史承春
Owner KUNSHAN LIANTAO ELECTRONICS CO LTD
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