Paper box packaging machine with drying function

Abstract

The invention discloses a paper box packaging machine with a drying function. The paper box packaging machine with the drying function structurally comprises a support, a feeding device, a packaging device, an electric box and a paperboard feeding machine. The top face of the support is connected with the bottom face of the packaging device in a welded manner, the back face of the electric box is welded to the front face of the packaging device, and the front face of the packaging device and the back face of the paperboard feeding machine communicate with each other and are connected through electric welding. According to the paper box packaging machine, in the drying link, when air flow is sucked inside from the outside, the air flow firstly passes through an air suction plate at the top of a drying bin, the air flow can enter the drying bin in after being sucked in to reach a certain air pressure in the air suction plate, the entering air flow is larger, the drying speed is higher, meanwhile, in the entering process, through multi-channel guiding of an extending plate, after deceleration, adhesion is achieved through repeated contact of multiple contact heads, finally scraps are stored through a storage groove, so that the content of impurities contained in the entering air flow is greatly reduced, and the situation that cleanliness of workpieces is affected due to the fact that the sucked air flow is not clean when the workpieces such as wafers with the high cleanliness requirement are dried is avoided.

Description

technical field [0001] The invention relates to the field of automatic packaging for cartons, in particular to a carton packaging machine with a drying function. Background technique [0002] The carton packaging machine is a machine that can use the formed cardboard to automatically package the workpiece. It can automatically fold the cardboard into the required shape and wrap it on the outer layer of the workpiece. The carton packaging machine is used in the wafer processing plant When working, the wafer will produce a lot of waste chips during processing and cutting, and a certain amount of metal slag and silicon chips will adhere to the surface after processing. In order to avoid affecting the cleanliness of the wafer and facilitate subsequent processing, it is necessary to Wafers are cleaned, and when the cleaned wafers are packaged in cartons, in order to prevent the cartons from being softened when they come into contact with water, which will affect the supporting pe...

AI Technical Summary

Problems solved by technology

[0002] The carton packaging machine is a machine that can use the formed cardboard to automatically package the workpiece. It can automatically fold the cardboard into the required shape and wrap it on the outer layer of the workpiece. The carton packaging machine is used in the wafer processing plant When working, the wafer will produce a lot of waste chips during processing and cutting, and a certain amount of metal slag and silicon chips will adhere to the surface after processing. In order to avoid affecting the cleanliness of the wafer and facilitate subsequent processing, it is necessary to Wafers are cleaned, and when the cleaned wafers are packaged in cartons, in order to prevent the cartons from being softened when they come into contact with water, which will affect the supporting performance of the cartons, they must be dried first after being sent to the carton packaging machine. Wafers have high requirements on smoothness, so most of them use non-contact hot air drying. During hot air drying, the air is drawn in from the outside through the exhaust fan, and heated by the electric heating tube to become hot air. The wafer is blown to take away its moisture. During the process of sucking in the air, some of the waste generated during the processing of the wafer remains in the air, which is easily sucked in by the pump again and spread on the surface of the wafer again. , which has a negative impact on the cleanliness of the wafer, which is not conducive to the subsequent processing

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