Low-thermal-resistance projection light source heat dissipation device

Abstract

The invention discloses a low-thermal-resistance projection light source heat dissipation device which comprises an LED light source, a heat expansion piece, a pressing plate, a profile heat dissipation device and a heat dissipation fan. The LED light source, the heat expansion piece and the profile heat dissipation device are sequentially arranged in an attached mode. The pressing plate is attached to the heat expansion piece, and the pressing plate and the LED light source are located on the same side and staggered in position. And the cooling fan is arranged on one side of the profile radiator. Through the heat expansion sheet, the overall heat conduction speed of the sectional material radiator is obviously improved, so that the heat dissipation speed of the LED light source is improved, the wafer temperature of the LED light source is effectively reduced, and obvious positive effects are achieved on the aspects of prolonging the service life of the LED light source, improving the brightness output of a projector and the like. Meanwhile, the heat dissipation device still has the characteristics of durability and low cost of the radiator which is purely made of the sectional material, and the cost is slightly increased compared with that of the existing radiator which is purely made of the sectional material.

Description

technical field [0001] The invention relates to the field of projectors, in particular to a heat dissipation device for a projection light source with low thermal resistance. Background technique [0002] The light source cooling device of the existing projector includes: cooling fan and radiator, the radiator is directly connected with the LED light source, the heat generated by the LED light source is directly conducted to the radiator, and then the heat on the radiator is blown to the projector through the cooling fan The exterior of the housing is used to realize the purpose of heat dissipation of the LED light source. Existing radiators generally use profile radiators (common such as Figure 4 straight rib profile shown) or heat pipe radiator (for higher power, such as Figure 5 heat pipe heat sink with double-ended loop shown). [0003] Existing profile radiators are generally obtained by extruding aluminum and aluminum alloy materials such as 6063. Although profile r...

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Problems solved by technology

[0003] Existing profile radiators are generally obtained by extruding aluminum and aluminum alloy materials such as 6063. Although profile radiators are durable, they are affected by factors such as external dimensions and thickness in specific applications. As a result, although the cost of profile radiators is low, the heat conduction, poor thermal performance

The heat pipe radiator has good heat dissipation effect, but the price of high-quality heat pipe radiator is relatively high (about 10 times higher than the cost of profile radiator), and most domestic projectors cannot afford its cost; The cost of the radiator is about 2-4 times higher), not only its own quality is unreliable (such as easy to leak and fail), but also the fins on the heat pipe generally have poor contact with the heat pipe, which leads to the short life of the heat pipe radiator And the quality dispersion is large

Therefore, in the existing mid- and low-priced projectors, people still choose to use profile radiators to dissipate heat from the LED light source. Not only is the profile radiator durable, but it can also effectively reduce the cost of the projector, although the profile radiator has poor heat dissipation

[0004] The above-mentioned 6063 and other aluminum and aluminum alloy profile radiators have a thermal conductivity of about 200W / (m·k), and the thermal conductivity is the same in each direction, and the thermal conductivity and thermal expansion performance are low, which is not conducive to the rapid heat dissipation of the LED light source. How to design a A light source cooling device with higher heat conduction and heat expansion performance and an insignificant increase in cost compared to existing profile radiators has become an urgent problem to be solved by those skilled in the art

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