Semiconductor refrigeration ice cream machine with fast heat dissipation and large refrigerating capacity

Abstract

The invention discloses a semiconductor refrigeration ice cream machine which is fast in heat dissipation and large in refrigerating capacity, the semiconductor refrigeration ice cream machine comprises a main machine body and a refrigeration mechanism, the refrigeration mechanism comprises a semiconductor refrigerator and a heat dissipation device, and a heat pipe set is arranged on a first plate face, making contact with the semiconductor refrigerator, in a heat dissipation substrate. The heat pipe set penetrates through a joint area, making contact with the semiconductor cooler, in the first plate face. A plurality of parallel heat conduction micro-channels are arranged in the heat dissipation substrate, and heat conduction phase change working media are injected into the heat conduction micro-channels. And a plurality of fins are arranged on a second plate surface, deviating from the heat pipe group, in the heat dissipation substrate. The heat conduction micro-channel is arranged in the heat dissipation device and is used in cooperation with the heat pipe set, high-heat-flow local heat energy of the semiconductor cooler is transmitted to the whole heat dissipation substrate together, the heat dissipation substrate of the sectional material achieves temperature equalization, the defects that a solid sectional material is low in heat transfer coefficient and large in heat transmission resistance are overcome, and the heat dissipation efficiency is improved. The problem that the heat flow density of the hot end of the semiconductor cooler is large is effectively solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor refrigeration, in particular to a semiconductor refrigeration ice cream machine with fast heat dissipation and large cooling capacity. Background technique [0002] Semiconductor refrigeration technology has the characteristics of compact structure, small modularization, convenient cooling capacity control, no vibration in work, and convenient movement of its core refrigeration system. use efficiently. With the continuous improvement of semiconductor refrigeration technology, semiconductor refrigeration has begun to extend its application to products with refrigeration function requirements, resulting in small semiconductor refrigeration ice cream machines, such as the technical solutions disclosed in existing patents 200420021510.9 and 201710927314.X, which realize DIY ice cream make. [0003] Different from mechanical compression refrigeration, semiconductor refrigeration belongs to temp...

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Problems solved by technology

From the structure of the aforementioned ice cream machine patent, it can be seen that in order to ensure the miniaturization of the ice cream machine, aluminum profiles are used as the radiator at the hot end of the semiconductor refrigerator. Since the thermal conductivity of the aluminum profile radiator is small (generally 150-230W / mk), The heat conduction resistance is large, the heat flow density at the hot end of the semiconductor refrigerator is large, the heat is concentrated and difficult to transfer to the surroundings of the radiator, and the cooling performance of the cold end of the refrigerator, such as cooling capacity and conversion efficiency, is affected.

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