Acid supply system for reducing generation of bubbles
A technology for supplying acid and air bubbles, applied in electrical components, foam dispersion/prevention, filtration circuits, etc., can solve problems such as product insolvency, scrap, product damage, etc., to achieve stable relative concentration, reduce bubble accumulation, and reduce crystallization. Effect
Inactive Publication Date: 2021-06-01
PNC PROCESS SYSTEMS CO LTD +1
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Problems solved by technology
The above-mentioned solvents or mixed solutions are used in the processing of semiconductor wafers, such as cleaning, etching, electroplating, polishing, grinding, etc., and there are related literatures in the academic and industrial circles that use wet processes on wafers In the process, because the bubbles generated before and after the reaction between the wafer and the solution will cause defects that cannot be solved for the process products during contact, resulting in product damage or the need to be scrapped, so a wet method can be established. The liquid line of the process can produce the device for removing air bubbles
Method used
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[0032] Further, as a preferred embodiment, a liquid return surface 13 and a bubble breaking structure 14 are provided on the inner wall at one end of the second pipeline 12, and there is also a flow guide structure on the inner wall at one end of the second pipeline 12, and the flow guide structure It is opposite to the bubble breaking structure 14 . Wherein, the bubble breaking structure 14 is disposed on the lower side of the liquid return surface 13 . In this example, if image 3 As shown, the liquid return surface 13 has an arc-shaped surface structure, the first pipeline 11 and the second pipeline 12 are perpendicular to each other, and the first pipeline 11 and the second pipeline 12 are connected by a fitting interface. One pipeline 11 is arranged horizontally, the second pipeline 12 is arranged vertically, and the flow guide structure is a deflector plate, which is inclined from top to bottom to the side close to the bubble breaking structure 14 . Such as image 3 A...
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The invention discloses an acid supply system for reducing generation of bubbles, and relates to the technical field of bubble removal. The acid supply system comprises a framework, a pump, a heating type buffer, main pipelines, an auxiliary pipeline, an acid liquor filter and a plate for fixing a valve, wherein the pump, the heating type buffer and the acid liquor filter are respectively arranged on the framework; the heating type buffer and the acid liquor filter are located on the upper side of the pump, and the heating type buffer is located on one side of the acid liquor filter; the pump is connected with the acid liquor filter and the heating type buffer through the main pipelines, and the heating type buffer is connected with the acid liquor filter through the auxiliary pipeline; and each main pipeline is fixedly connected with the framework through the plate for fixing the valve. According to the invention, the phenomena of acid liquid crystallization and bubble accumulation can be reduced, and the phenomenon of wafer surface unevenness caused by the process due to unstable concentration output caused by intermittent infusion is avoided.
Description
technical field [0001] The invention relates to the technical field of degassing, in particular to an acid supply system for reducing the generation of bubbles. Background technique [0002] In the field of semiconductor manufacturing, especially in the wet process, various solutions, such as acids, alkalis, organic solutions and special processing slurries, are routinely used. The above-mentioned solvents or mixed solutions are used in the processing of semiconductor wafers, such as cleaning, etching, electroplating, polishing, grinding, etc., and there are related literatures in the academic and industrial circles that use wet processes on wafers In the process, because the bubbles generated before and after the reaction between the wafer and the solution will cause defects that cannot be solved for the process products during contact, resulting in product damage or the need to be scrapped, so a wet method can be established. The liquid piping of the process produces the ...
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IPC IPC(8): B01D36/00B01D35/01B01D19/02H01L21/67
CPCB01D36/001B01D19/02H01L21/67
Inventor 邓信甫国天增刘大威陈丁堃
Owner PNC PROCESS SYSTEMS CO LTD