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Infrared thermal imaging detection device and detection method for defects of electronic parts

A technology of electronic components and infrared thermal imaging, which is applied in the direction of measuring devices, optical devices, neural learning methods, etc., to achieve the effects of improving detection efficiency, ensuring detection accuracy, and improving production efficiency

Pending Publication Date: 2021-06-04
四川宇然智荟科技有限公司
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  • Abstract
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  • Application Information

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Problems solved by technology

[0010] For precision electronic components such as inductors to be inspected, the present invention provides an infrared thermal imaging detection device and detection method for defects in electronic components. Compared with conventional methods for detecting deformation, concentricity, parallelism, poor shape, and size Detection, this method mainly realizes the detection of scratches, chipping, cracks, dark cracks and other difficult defects. At the same time, it has noise suppression and is not affected by dust, mosquitoes, oil and silk screens.

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  • Infrared thermal imaging detection device and detection method for defects of electronic parts
  • Infrared thermal imaging detection device and detection method for defects of electronic parts
  • Infrared thermal imaging detection device and detection method for defects of electronic parts

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Embodiment Construction

[0051] Combined with the implementation of the specific technical solutions to illustrate the present invention.

[0052] Such as figure 1 As shown, the infrared thermal imaging detection device for electronic component defects includes a laser heater 2, an infrared image sensor, and an optical module 1 sequentially arranged above the conveyor belt 4, and the laser heater 2 controls the electronic components on the conveyor belt 4. 3 heating, the infrared image sensor and the optical module 1 take pictures of the heated electronic components 3 .

[0053] The present invention includes two main links, the sub-graph segmentation of electronic components 3 and the segmentation and classification of surface defects of components. The infrared image containing n electronic components 3 on the laser-heated surface is collected by an infrared sensor. The electronic components 3 are vibrated by a vibrating plate before entering the heating zone, and are sparsely distributed on the co...

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Abstract

The invention relates to an infrared thermal imaging detection device and method for defects of electronic parts, and the infrared thermal imaging detection device comprises a laser heater, an infrared image sensor and an optical module which are sequentially arranged above a conveying belt, and the laser heater is used for heating the electronic parts on the conveying belt; and the infrared image sensor and the optical module are used for shooting the heated electronic part. Through infrared thermal imaging, not only can defect characteristics such as scratches, corner chipping and cracks be obtained, but also dark crack characteristics can be captured, and target detection is performed on image defects through the neural network, so that the detection efficiency is greatly improved. Compared with a visible light image, the adopted infrared thermal imaging picture is interfered by fewer noisy points, dust and stains, so that surface layer silk-screen textures can be pressed to a certain extent, and the interference of the noisy points and silk-screen on defect detection is avoided.

Description

technical field [0001] The invention belongs to the technical field of electronic component detection, and specifically relates to an infrared thermal imaging detection device and detection method for electronic component defects, mainly aimed at the electronic component production industry, and used for the quality of surface defects and internal defects of electronic component products Detection method. Background technique [0002] In the field of electronic component production and processing, automated assembly lines are basically realized at present. Taking precision wound inductors as an example, an electronic component will probably go through the following steps of processing: (1) Materials such as magnetic cores are sent to the assembly line from the equipment entrance, and coil winding is completed on the precision winding machine in sequence through the conveyor belt; ( 2) Send it to the laser paint removal equipment through the conveyor belt to remove the surfa...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/00G06T7/11G06T7/13G06N3/04G06N3/08G01B11/00
CPCG06T7/0004G06T7/11G06T7/13G06N3/08G01B11/00G06T2207/10048G06N3/045
Inventor 靳飞张磊胡明陶斯禄
Owner 四川宇然智荟科技有限公司