Component laminating method, component laminating system and laminating equipment
A technology for laminating equipment and components, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of wafer deviation, improper lamination, unsatisfactory yield, etc., to improve yield without affecting The effect of efficiency
Pending Publication Date: 2021-06-04
SHEN ZHEN TALUER TECH CO LTD
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Problems solved by technology
[0004] Disadvantages: There is a certain probability that the above method will not get the crystal correctly during the material picking process, and there is also a certain probability that the wafer will be deviated during the arm swing process, resulting in incorrect bonding and unsatisfactory yield
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[0028] Such as figure 2 As shown, the invention discloses a bonding equipment, and the components of the invention include existing chips and components.
[0029] The bonding equipment includes a component supply table, a bonding table, a detection camera, a bonding head, and a bonding head driving mechanism that drives the motion of the bonding head. The bonding head is provided with a suction nozzle, and the components are The supply table is used to place components, the bonding table is used to place substrates (such as PCB), and the bonding head driving mechanism is used to drive the bonding head to supply the components on the table. transported to the substrate of the bonding station for bonding; the detection camera is used to capture photos of the components in the process of the bonding head transporting the components, and obtain the deviation angle of the components and components after algorithm processing The XY deviation distance of the center point of compone...
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The invention provides a component laminating method, a component laminating system and laminating equipment. The component laminating method comprises the following steps: 1, controlling a laminating head to suck a component; 2, controlling the laminating head to move towards a laminating table, and controlling a detection camera to capture pictures of the moving laminating head and the component to obtain a component deviation angle and a component center point XY deviation distance; 3, controlling the laminating head to move to the position above the laminating table, and controlling the laminating table to rotate according to the obtained deviation angle of the component so as to perform angle compensation on the laminating position of the component; according to the obtained XY deviation distance of the central point of the component, controlling the laminating table to move in the XY direction, so that the laminating position of the component is compensated in the XY direction; and then, using the laminating head for laminating the component on the substrate on the laminating table. The beneficial effect of the invention is that the industrial difficulty that the laminating equipment (especially a swing arm die bonder) cannot straighten a component (such as a wafer) at the laminating end is solved.
Description
technical field [0001] The invention relates to the technical field of chip / component bonding, in particular to a component bonding method, system and bonding equipment. Background technique [0002] With the advancement of science and technology, the size of chips and components is getting smaller and smaller, and the requirements for the bonding accuracy of chips and components are getting higher and higher, while traditional bonding equipment (for example, swing arm solid crystal machine) Machine vision can only be used for initial positioning at the pick-up and bonding ends, and there is a certain probability that the position of the wafer and the suction nozzle will deviate during the pick-up and arm swing process, resulting in an unsatisfactory overall yield. [0003] Such as figure 1 As shown, the swing arm die bonding machines currently on the market basically place cameras on the wafer ring and the die bonding table, use machine vision to perform initial positionin...
Claims
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IPC IPC(8): H01L21/67H01L21/68
CPCH01L21/67092H01L21/67265H01L21/681
Inventor 岳帮火刘耀金曾逸
Owner SHEN ZHEN TALUER TECH CO LTD