Reverse copper foil processing equipment

Abstract

The invention discloses reverse copper foil processing equipment, and belongs to the technical field of machining equipment. The reverse copper foil processing equipment comprises a copper foil combination belt, a first transmission roller set used for conveying the copper foil combination belt, a dry film combination belt, a second transmission roller set used for conveying the dry film combination belt, a dry film engraving belt and a third transmission roller set used for conveying the dry film engraving belt, and the surface of the copper foil combination belt is provided with first rough textures. The dry film engraving belt and the dry film combination belt are synchronously conveyed, the dry film engraving belt is used for engraving a rough surface on the surface of the dry film combination belt, and the copper foil combination belt and the dry film combination belt are in pressing fit through a pressing mechanism. According to the device, the binding force of the copper foil and the dry film can be improved without excessive pressing force, deformation of materials is reduced, the elongation of the copper foil is guaranteed, and the residual copper rate can be reduced.

Description

technical field [0001] The invention belongs to the technical field of mechanical processing equipment, and in particular relates to a reverse copper foil processing equipment. Background technique [0002] One side of the electrolytic copper foil is smooth, and the other side is relatively rough. Generally, in the use of circuit boards, the roughened copper surface and the bonding surface will be bonded to make the copper foil and the bonding surface have a greater bonding force. If the rough surface is made on the surface of the circuit board, the uniform rough surface can be directly attached to the dry film, and a good bonding force can be achieved without too much pre-treatment. Therefore, manufacturers of copper clad laminates try to reverse the rough surface of the copper skin and treat the smooth surface to strengthen the bonding. This usage is the so-called usage of reversed copper foil. In order to achieve the preset bonding force, in the prior art, the combinatio...

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Problems solved by technology

In order to achieve the preset bonding force, in the prior art, the combination of the rough surface and the dry film is usually carried out by pressing rollers, which will cause deformation of the copper foil and the dry film, and affect the elongation of the board. Due to the large pressure on the rough surface, it is easy to produce residual copper after etching, which loses some advantages of reversed copper foil, and easily leads to a decrease in its surface bonding force.

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