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Epoxy resin toughening curing agent as well as preparation method and application thereof

A technology of epoxy resin and curing agent, which is applied in the direction of epoxy resin glue, epoxy resin coating, adhesive, etc., can solve the problems such as inability to achieve toughening and improving effects, and achieve improved toughening and improving effects. The preparation method is simple, The effect of broad market prospects

Active Publication Date: 2021-06-11
上海稳优实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the embodiments of the present invention is to provide an epoxy resin toughening and curing agent to solve the problem that the existing epoxy resin curing agent proposed in the above background technology cannot achieve a good toughening and improving effect

Method used

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  • Epoxy resin toughening curing agent as well as preparation method and application thereof

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preparation example Construction

[0017] As another preferred embodiment of the present invention, the preparation method of the modified diphenylmethane-4,4'-diisocyanate comprises: weighing diphenylmethane-4,4'-diisocyanate and heating to 45-65 ℃, then vacuumize and add triglyceride and polypropylene glycol to mix, then add acrylate and 2-ethyl-1,3-hexanediol and heat to 45-65℃ for heat preservation, vacuumize to remove moisture, and obtain the obtained Modified diphenylmethane-4,4'-diisocyanate described above.

[0018] As another preferred embodiment of the present invention, in the preparation method of the modified diphenylmethane-4,4'-diisocyanate, the vacuuming is carried out by using a negative pressure pump until the vacuum degree is 0.6- 60Pa, because the modified diphenylmethane-4,4'-diisocyanate is produced by heating and reacting under negative pressure and vacuum conditions, while ensuring the normal progress of the reaction, it effectively reduces the reaction caused by excessive reaction tempe...

Embodiment 1

[0038]An epoxy resin toughening curing agent, including the following raw materials: 80 kilograms of modified diphenylmethane-4,4'-diisocyanate, polyoxypropylene triol (molecular weight is 400, and the hydroxyl group of polyoxypropylene triol The value is 80 mgKOH / g) 7 kg, polycaprolactone polyol 20 kg, isobutylene-maleic anhydride copolymer 1 kg, imidazole compound 20 kg, and an appropriate amount of organic solvent. Wherein, the usage amount of the organic solvent is 60wt% of the weight of the modified diphenylmethane-4,4'-diisocyanate. The imidazole compound is dimethylimidazole. The organic solvent is N,N-dimethylformamide.

[0039] In the present embodiment, the preparation method of the epoxy resin toughening curing agent specifically includes the following steps:

[0040] 1) According to the mass ratio of diphenylmethane-4,4'-diisocyanate, triglyceride, polypropylene glycol, acrylate and 2-ethyl-1,3-hexanediol is 12:20:18:1: Weigh diphenylmethane-4,4'-diisocyanate at...

Embodiment 2

[0044] An epoxy resin toughening curing agent, including the following raw materials: 120 kilograms of modified diphenylmethane-4,4'-diisocyanate, polyoxypropylene triol (molecular weight is 1200, and the hydroxyl group of polyoxypropylene triol The value is 120 mgKOH / g) 15 kg, polycaprolactone polyol 40 kg, isobutylene-maleic anhydride copolymer 6 kg, imidazole compound 50 kg, and an appropriate amount of organic solvent. Wherein, the usage amount of the organic solvent is 130wt% of the weight of the modified diphenylmethane-4,4'-diisocyanate. The imidazole compound is dimethylimidazole. The organic solvent is N,N-dimethylformamide.

[0045] In the present embodiment, the preparation method of the epoxy resin toughening curing agent specifically includes the following steps:

[0046] 1) According to the mass ratio of diphenylmethane-4,4'-diisocyanate, triglyceride, polypropylene glycol, acrylate and 2-ethyl-1,3-hexanediol is 18:40:40:8: Weigh diphenylmethane-4,4'-diisocyan...

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Abstract

The invention relates to the technical field of curing agent production, and particularly discloses an epoxy resin toughening curing agent and a preparation method and application thereof, and the epoxy resin toughening curing agent comprises the following raw materials: modified diphenylmethane-4, 4'-diisocyanate, polyoxypropylene triol, polycaprolactone polyol, an isobutylene-maleic anhydride copolymer, an imidazole compound and a proper amount of organic solvent. The modified diphenylmethane-4, 4'-diisocyanate, polyoxypropylene triol, polycaprolactone polyol and the like are used as raw materials, the prepared epoxy resin toughening curing agent can effectively improve the toughening improvement effect on epoxy resin, and compared with a traditional curing agent with a single component, the epoxy resin toughening curing agent is more comprehensive in function. The problem that an existing epoxy resin curing agent cannot achieve good toughening and improving effects is solved. Moreover, the preparation method provided by the embodiment of the invention is simple and has a wide market prospect.

Description

technical field [0001] The invention relates to the technical field of curing agent production, in particular to an epoxy resin toughening curing agent and its preparation method and application. Background technique [0002] With the continuous development of science and technology, people's performance requirements for bonding materials are also constantly improving. Among them, adhesives, potting glue and other products are common bonding materials used for bonding, which can realize rapid bonding between various materials, and have a wide range of applications in the fields of construction, interior decoration, and clothing production. application. Most of the common bonding materials are based on resin curing to achieve the bonding effect. One of the necessary raw materials is the curing agent, which produces chemical reactions such as condensation, ring closure, addition or catalysis through the curing agent, so that thermosetting The resin cures to achieve an adhesi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/40C08G18/62C08G18/48C08G18/42C09D163/00C09J163/00
CPCC08G59/4057C08G18/6204C08G18/4829C08G18/4277C08G18/4063C08G18/4018C09D163/00C09J163/00
Inventor 刘祥飞吕言言
Owner 上海稳优实业有限公司
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