Epoxy resin toughening curing agent as well as preparation method and application thereof
A technology of epoxy resin and curing agent, which is applied in the direction of epoxy resin glue, epoxy resin coating, adhesive, etc., can solve the problems such as inability to achieve toughening and improving effects, and achieve improved toughening and improving effects. The preparation method is simple, The effect of broad market prospects
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[0017] As another preferred embodiment of the present invention, the preparation method of the modified diphenylmethane-4,4'-diisocyanate comprises: weighing diphenylmethane-4,4'-diisocyanate and heating to 45-65 ℃, then vacuumize and add triglyceride and polypropylene glycol to mix, then add acrylate and 2-ethyl-1,3-hexanediol and heat to 45-65℃ for heat preservation, vacuumize to remove moisture, and obtain the obtained Modified diphenylmethane-4,4'-diisocyanate described above.
[0018] As another preferred embodiment of the present invention, in the preparation method of the modified diphenylmethane-4,4'-diisocyanate, the vacuuming is carried out by using a negative pressure pump until the vacuum degree is 0.6- 60Pa, because the modified diphenylmethane-4,4'-diisocyanate is produced by heating and reacting under negative pressure and vacuum conditions, while ensuring the normal progress of the reaction, it effectively reduces the reaction caused by excessive reaction tempe...
Embodiment 1
[0038]An epoxy resin toughening curing agent, including the following raw materials: 80 kilograms of modified diphenylmethane-4,4'-diisocyanate, polyoxypropylene triol (molecular weight is 400, and the hydroxyl group of polyoxypropylene triol The value is 80 mgKOH / g) 7 kg, polycaprolactone polyol 20 kg, isobutylene-maleic anhydride copolymer 1 kg, imidazole compound 20 kg, and an appropriate amount of organic solvent. Wherein, the usage amount of the organic solvent is 60wt% of the weight of the modified diphenylmethane-4,4'-diisocyanate. The imidazole compound is dimethylimidazole. The organic solvent is N,N-dimethylformamide.
[0039] In the present embodiment, the preparation method of the epoxy resin toughening curing agent specifically includes the following steps:
[0040] 1) According to the mass ratio of diphenylmethane-4,4'-diisocyanate, triglyceride, polypropylene glycol, acrylate and 2-ethyl-1,3-hexanediol is 12:20:18:1: Weigh diphenylmethane-4,4'-diisocyanate at...
Embodiment 2
[0044] An epoxy resin toughening curing agent, including the following raw materials: 120 kilograms of modified diphenylmethane-4,4'-diisocyanate, polyoxypropylene triol (molecular weight is 1200, and the hydroxyl group of polyoxypropylene triol The value is 120 mgKOH / g) 15 kg, polycaprolactone polyol 40 kg, isobutylene-maleic anhydride copolymer 6 kg, imidazole compound 50 kg, and an appropriate amount of organic solvent. Wherein, the usage amount of the organic solvent is 130wt% of the weight of the modified diphenylmethane-4,4'-diisocyanate. The imidazole compound is dimethylimidazole. The organic solvent is N,N-dimethylformamide.
[0045] In the present embodiment, the preparation method of the epoxy resin toughening curing agent specifically includes the following steps:
[0046] 1) According to the mass ratio of diphenylmethane-4,4'-diisocyanate, triglyceride, polypropylene glycol, acrylate and 2-ethyl-1,3-hexanediol is 18:40:40:8: Weigh diphenylmethane-4,4'-diisocyan...
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